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Compound for forming thick film conductor

A composition and conductor technology, applied in the direction of conductive coatings, conductive materials dispersed in non-conductive inorganic materials, metal pattern materials, etc., can solve the problems of preventing corrosion, forming uniform electrode films, and fully analyzing high-silicon-rich materials. Ridge stone and other problems, to achieve the effect of less erosion

Active Publication Date: 2006-08-23
SUMITOMO METAL MINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the composition for conductive paste described in JP-A-6-223616 uses lead-containing glass powder, which is not preferable from the viewpoint of environmental pollution.
In addition, as described in JP-A-6-223616, if the PbO in the glass powder is less than 15% by mass, the silica-rich kaolinite cannot be sufficiently separated, and it is difficult to prevent corrosion with a lead-free conductive paste.
If the electrode paste is fired at a temperature above 900°C, it is easy to cause over-sintering of the electrode film, or the electrode film in the electrode paste containing Ag with a low melting point as the main component becomes island-shaped, and there is a problem that a uniform electrode film cannot be formed. The problem

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] To the conductive powder composed of 99.0 parts by mass of granular Ag powder with an average particle diameter of 1.5 μm and 1.0 parts by mass of granular Pd powder with an average particle diameter of 0.1 μm, 5 parts by mass of the average Glass powder A with a particle size of 3 μm, and 1 part by mass of Al with an average particle size of 0.5 μm 2 o 3 powder, and a terpineol solution of ethyl cellulose was added as a vehicle, and kneaded with three roller mills to prepare a thick-film conductor-forming slurry.

[0040] The produced thick-film conductor-forming paste was screen-printed on a 96% alumina substrate, and dried at 150°C. The dried substrate was fired in a mesh belt furnace at a peak temperature of 850° C. for 9 minutes for a total of 30 minutes to form a thick conductor film having a predetermined pattern.

[0041] Evaluation of the film thickness of the obtained thick-film conductor was carried out by measuring a 2.0 mm×2.0 mm spacer with a stylus-type...

Embodiment 2、3

[0047] Embodiment 2,3, comparative example 1,2

[0048] Except having changed the usage-amount and the kind of glass powder as shown in Table 1 and Table 2, thick-film conductors were obtained similarly to Example 1, and it measured similarly to Example 1.

[0049] Table 3 shows the film thickness, area resistance value, solder resistance, and adhesive strength of the thick-film conductors measured.

Embodiment 2

[0050] Even if the thick-film conductor in Example 2 was dipped in solder 12 times, the area resistance value was 10Ω or less, no disconnection occurred, and the solder resistance was excellent. In addition, the adhesive strength is also 60N or more.

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Abstract

An object of the present invention is to provide a composition for forming a thick-film conductor which is less in corrosion and does not contain lead. In order to achieve the above object, a composition for forming a thick-film conductor composed of conductive powder, oxide powder, and organic vehicle is used. Wherein, the oxide powder includes SiO2-B2O3-Al2O3-CaO-Li2O glass powder and Al2O3 powder. The composition ratio of the SiO2-B2O3-Al2O3-CaO-Li2O-based glass powder is SiO2: 20-60% by mass, B2O3: 2-25% by mass, Al2O3: 2-25% by mass, CaO: 20-50% by mass, and Li2O: 0.1-10 mass %, 0.1-15 mass parts of SiO2-B2O3-Al2O3-CaO-Li2O-based glass powder and 0.1-8 mass parts of Al2O3 powder with respect to 100 mass parts of conductive powder.

Description

technical field [0001] The present invention relates to a composition for forming a lead-free thick-film conductor, and more particularly to a composition for forming a thick-film conductor on a ceramic substrate or the like when manufacturing chip resistors, resistor grids, hybrid ICs, etc. Composition for thick film conductor formation. Background technique [0002] When using thick film technology to form thick film conductors, generally, conductive powder with high conductivity and oxide powder such as glass powder are dispersed in an organic vehicle to obtain a conductive paste, which is printed by screen printing, etc. The conductive paste is applied in a predetermined shape on a ceramic substrate such as an alumina substrate, and fired at 500° C. to 900° C. to form a thick-film conductor. [0003] As the conductive powder, a powder composed of Au, Ag, Pd, or Pt having high conductivity and having an average particle diameter of 10 μm or less is used. In particular, i...

Claims

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Application Information

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IPC IPC(8): H01B1/14C09D5/24H05K1/09C04B35/00
CPCC03C3/064C03C3/091C03C8/18
Inventor 川久保胜弘安达良典粟洼慎吾
Owner SUMITOMO METAL MINING CO LTD
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