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Liquid-cooled heat sink

A heat dissipation device and liquid cooling technology, applied in cooling/ventilation/heating transformation, instrumentation, electrical digital data processing, etc., can solve problems such as heat absorption or external heat dissipation, limited heat dissipation speed, and increased cost, etc., to achieve Best heat dissipation effect, reduced production cost, and large heat storage effect

Inactive Publication Date: 2006-07-19
FU ZHUN PRECISION IND SHENZHEN +1
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AI Technical Summary

Problems solved by technology

Although a number of partitions provided in the box can increase the heat exchange area with the cooling liquid, the box body itself is too small, and the heat exchange area it can provide will not be large
In addition, the heat absorbed by the box from the electronic components is mainly dissipated through the circulation of the liquid, and the heat dissipation speed is extremely limited
The device is not ideal for absorbing heat from the electronic components or dissipating heat outward
[0005] In addition, the aforementioned two patents both use pumps to drive the circulation of the cooling liquid in the cooling device. Not only does the pump itself require cost, but the work of the pump also requires external energy such as electric energy to drive, which increases the cost, and due to The use of pumps will inevitably cause noise problems

Method used

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  • Liquid-cooled heat sink
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Embodiment Construction

[0013] see Figure 1 to Figure 3 The liquid-cooled heat dissipation device 10 of the present invention includes a radiator 12 installed on electronic components (not shown) such as a central processing unit (not shown) in the cabinet 20 for cooling, and a radiator 12 that is independent of the radiator 12 and installed on an appropriate part of the cabinet 20. The liquid storage tank 14 and several heat pipes 16 connected to the radiator 12 and the water storage tank 14 by its two ends respectively.

[0014] Above-mentioned heat sink 12 comprises a base 120 that contacts on the electronic component and is fixed on the circuit board 30 and a plurality of cooling fins 122 that are arranged and formed on this base 120, and several grooves 124 are also provided on this base 120, for One end of the heat pipe 16 is thermally connected.

[0015] The liquid storage tank 14 is substantially a cuboid cavity, which has a larger volume to hold a large amount of liquid, such as water. In...

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Abstract

The invention relates to a liquid cooling heat radiation device, which comprises a heat radiator contacting the heating electric element, a liquid storage bank containing the liquid and at least one heat pipe. Wherein, the liquid storage bank is independent from the heat radiator and mounted on the frame; one end of heat pipe is connected to the heat radiator, while another end is connected to the liquid storage bank and dipped in the liquid. The invention has simple structure, lower cost, less noise and better heat radiation effect.

Description

【Technical field】 [0001] The invention relates to a heat dissipation device, in particular to a liquid-cooled heat dissipation device for computer system heat dissipation. [Background Technology 1 [0002] With the increasing heat generation of electronic components such as central processing units and the miniaturization of electronic products, traditional heat sinks are restricted by various factors such as available space and cost, and it is difficult to greatly improve their heat dissipation performance. , while the noise problem is getting more and more attention. Therefore, as the heat dissipation problem of PC products is becoming more and more serious today, the new heat dissipation device using liquid as the medium has once become the darling of research and application in the field of heat dissipation due to its advantages such as low noise, and some liquids, such as water, have high specific heat and no pollution. Many advantages, such as low cost and so on, make...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/34H01L23/473G06F1/20H05K7/20
Inventor 何立
Owner FU ZHUN PRECISION IND SHENZHEN
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