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Hot compressing link method of polymer microfluid system

A microfluidic system and thermocompression bonding technology, applied in the field of thermocompression bonding of polymer microfluidic systems, can solve problems such as reducing the glass transition temperature of the polymer surface, shorten the bonding time and solve the bonding strength. Problems, the effect of simple craftsmanship

Inactive Publication Date: 2006-07-12
UNIV OF SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention proposes a thermocompression bonding method for a polymer microfluidic system, which reduces the glass transition temperature of the polymer surface by adding polymer monomers or homologues, so as to solve the polymer microfluidic problems that have not been solved in the prior art System thermocompression bond strength issues

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Example 1. Bonding of polymethylmethacrylate (PMMA) microfluidic systems

[0014] 1) Cleaning and drying of PMMA flakes

[0015] Take two 2mm thick PMMA sheets, one contains microstructure graphics, and its surface flatness is less than 1 micron, and the other does not contain graphics, and the size is 5cm×5cm. First clean the two PMMA sheets with ethanol, then wash them with deionized water, then put the two PMMA sheets in an oven for 4 hours at 80°C, and finally store them in a drying oven.

[0016] 2) Surface modification of PMMA flakes

[0017] Put the PMMA sheet without microstructure pattern on the glue spinner, add the polymer monomer methyl methacrylate (MMA) dropwise on the sheet, spin coating at 1000 rpm for 10 seconds.

[0018] MMA can dissolve PMMA, but it is not a good solvent for PMMA. If the surface smoothness of the PMMA containing the microstructure is better, the surface modification of the PMMA flakes can be carried out by using the spin coating me...

Embodiment 2

[0025] Example 2. Bonding of polymethylmethacrylate (PMMA) microfluidic systems

[0026] 1) Cleaning and drying of PMMA flakes

[0027] Take two 2mm thick PMMA sheets, one contains microstructure graphics, and its surface flatness is greater than 1 micron, and the other does not contain graphics, and the size is 5cm×5cm. First clean the two PMMA sheets with ethanol, then wash them with deionized water, then put the two PMMA sheets in an oven for 4 hours at 80°C, and finally store them in a drying oven.

[0028] 2) Surface modification of PMMA flakes

[0029] Add the polymer monomer MMA into the glass container, then put the PMMA sheet without microstructure pattern into the MMA, take it out after 1 minute, and blow off the MMA attached to the surface with nitrogen.

[0030] MMA can dissolve PMMA, but it is not a good solvent for PMMA. If the surface smoothness of PMMA containing microstructure is not good, the surface modification of PMMA flakes can be carried out by impreg...

Embodiment 3

[0035] Example 3. Bonding of polystyrene (PS) microfluidic systems

[0036] 1) Cleaning and drying of PS flakes

[0037] Take two 2mm thick PS slices, one contains microstructure graphics, and its surface unevenness is less than 1 micron, and the other does not contain graphics, both of which are 5cm×5cm in size. First clean the two PS sheets with ethanol, then wash them with deionized water, then put the two PS sheets in an oven at 75°C for 4 hours, and finally put them in a drying oven for storage.

[0038] 2) Surface modification of PS flakes

[0039] Add the polymer monomer styrene into the glass container, then heat the PS sheet without microstructure pattern to 75°C, put it into the glass container, put it in the steam of styrene for 5 minutes, and then take it out.

[0040]Styrene is a good solvent for PS. If spin coating method or dipping method is used to modify the surface of PS flakes, too much styrene may be added to the surface of PS, so steam method is more app...

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PUM

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Abstract

The invention relates to a thermal compression bonding method of polymer micro-liquid system. First, cleaning the surface of a polymer with micro structure and the surface of another polymer without micro structure and keeping them dry, which is characterized in that adding the monomer or homologue of said polymer into the surface of polymer without said micro structure, while the added amount is 10-40% of the weight of added polymer surface, and the adding depth is 0.1-10 micrometers; arranging said two surfaces face-to-face between two plates and adding the pressure of 0.5-5MPa to be heated in the temperature which is lower 5-20Deg. C than the vitrification temperature of said polymer for 2 minutes; removing pressure to be cooled slowly to room temperature to attain bonded polymer micro-liquid system. The adding method can select steam method, rotary plating method or dipping method. The invention can reduce the vitrification temperature of polymer surface, solve the bonding strength problem, and improve the bonding efficiency via adding polymer monomer or homologue, while it has simple process and the application to the bonding of polymer micro structures with different surface flatness.

Description

Technical field: [0001] The invention belongs to the technical field of bonding methods for micro-electromechanical systems, in particular to the thermocompression bonding technology of polymer microfluidic systems. Background technique: [0002] With the development of microfabrication technology, the research on microfluidic chips and biochips based on polymer materials has been paid more and more attention, forming a new class of biochemical microfluidic system devices. Polymer materials not only have good biocompatibility, but also have a wide variety and low price, and are easy to achieve large-scale and low-cost production through molding, injection molding and other replication techniques, overcoming the silicon or glass materials. The high cost and low yield limitations of biochemical microsystems. At the same time, polymer materials can easily change the electroosmotic flow through surface modification, which has broad application prospects. [0003] Bonding is a ...

Claims

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Application Information

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IPC IPC(8): B29C65/02
Inventor 刘刚朱学林田扬超阚娅
Owner UNIV OF SCI & TECH OF CHINA
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