Semiconductor device

A semiconductor and device technology, applied in the field of semiconductor devices, can solve the problem of low heating efficiency, achieve the effect of reducing cost, reducing cost, and preventing area increase

Inactive Publication Date: 2005-12-07
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the indirect heating of the semiconductor device makes the heating efficiency very low

Method used

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  • Semiconductor device
  • Semiconductor device
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Examples

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Effect test

no. 1 example

[0050] figure 1 is a block diagram showing the structure of a portion that detects temperature and performs heating in the semiconductor device according to the first embodiment of the present invention. exist figure 1 Among them, the semiconductor device 100 according to the embodiment includes a temperature sensor portion (temperature detection means) 110 , a heat generation portion (heat generation means) 120 , and control wiring 130 . The temperature sensor 110 and the heat generating part 120 are electrically connected to each other through the control wiring 130 .

[0051] The temperature sensor section 110 includes a diode and a transistor having temperature characteristics, and outputs a heat generation instruction to the control wiring 130 when the temperature is equal to or lower than T degrees in normal operation of the semiconductor device 100, and outputs a heat generation instruction when the temperature is equal to or higher than T′ degrees. When (T′≧T), a n...

no. 2 example

[0060] Figure 7 is a block diagram showing the structure of a portion that detects temperature and performs heating in the semiconductor device according to the second embodiment of the present invention. exist Figure 7 Among them, the semiconductor device 100A according to this embodiment includes a plurality of heat generating sections 120 and is connected to the common temperature sensor section 110 . By providing the heat generating portion 120, the temperature sensor 110 can detect sudden cooling of the semiconductor device 100A, if any. Therefore, heating can be rapidly performed by the heat generating portion 120 so that the temperature of the semiconductor device 100A can be maintained constant or higher, and malfunction due to low temperature can be prevented.

no. 3 example

[0062] Figure 8 is a block diagram showing the structure of a portion that detects temperature and performs heating in a semiconductor device according to a third embodiment of the present invention. exist Figure 8 Among them, the semiconductor device 100B according to the present embodiment has a combination of a plurality of temperature sensor sections 110 and heat generating sections 120 connected thereto.

[0063] A combination of the temperature sensor 110 and the heat generating portion 120 is provided in the semiconductor device 100B. Even if a part of the semiconductor device 100B such as the local region 300 has a low temperature, therefore, the heat generating portion 120 in or near the local region 300 generates heat so that the semiconductor device 100B can be heated. Also, even if the temperature in the local area 300 rises under the heat generation of the heat generating portion 120, the temperature sensor portion 110 in or near the local area 300 detects the...

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PUM

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Abstract

It is an object to operate a semiconductor device within a desirable operating temperature range in a normal operation or a test operation. A semiconductor device 100 comprises a temperature sensor portion 110 for detecting a temperature to output a heat generation instruction when the temperature is equal to or lower than T degree and to output a heat generation stop instruction when the temperature is equal to or higher than T' degree, and a heat generating portion 120 for performing / stopping the generation of heat in accordance with the heat generation instruction / heat generation stop instruction from the temperature sensor 110. Even if a temperature around the semiconductor device is low, the semiconductor device 100 can be maintained to be a certain temperature or more without an influence thereof. When the temperature around the semiconductor device rises, moreover, heat is not generated. Consequently, it is possible to prevent a malfunction from being caused at a high or low temperature.

Description

technical field [0001] The present invention relates to a semiconductor device. Background technique [0002] In recent years, with the development of semiconductor technology, semiconductors have been used in various electronic devices. For example, electronic equipment using semiconductors is also suitable for use in various environments such as the signal processing section of portable communication terminals, the electronic control section of automobile engines, the image processing section of artificial satellites, and the image sensing section of medical equipment. [0003] Semiconductors are designed to operate normally under the conditions of the ambient temperature in which they will be used. By designing semiconductors to operate properly over the widest possible temperature range, it is possible to use electronic devices in a variety of temperature conditions. For example, home video cameras configured with semiconductors that operate normally at -40°C to 120°C ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/04G01R31/02H01L21/02H01L21/822H01L23/34H01L27/02
CPCH01L27/0248H01L2924/0002H01L23/34H01L23/345H01L2924/00
Inventor 岸下景介
Owner PANASONIC CORP
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