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Method for the manufacture of printed circuit boards with integral plated resistors

A technology for printed circuit boards and manufacturing methods, which is applied in the directions of printed circuit manufacturing, printed circuits, and secondary treatment of printed circuits, and can solve problems such as high porous plates, poor resistance metal deposition rate, and unqualified porous plates

Inactive Publication Date: 2005-10-26
MACDERMID INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Current effects can change the plating potential at the resistor location, making the deposition rate of the resistive metal poorer, resulting in missing plating, or significantly reducing the thickness of the plating, resulting in very high resistance values ​​or porous plates, which Multiwell plates will fail when tested

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment I

[0045] Copper-coated laminates are processed in the following sequence:

[0046] 1) Laminate a liquid or dry film on both copper surfaces of the laminate;

[0047] 2) exposing and developing the resist so that the desired circuit is protected and the resistor area is exposed;

[0048] 3) Print and etch the resistor area and desired circuit diagram;

[0049] 4) Strip the photoresist from the surface, then coat the surface of the plate with additional liquid or dry film photoresist;

[0050] 5) exposing and developing the resist to expose the resistor area and part of the adjacent copper circuitry;

[0051] 6) Treating the panel through an activation cycle typically used for activation of through-hole circuit boards, prior to activation, applying a mask to the panel so that only the surface is selectively activated;

[0052] 7) The photoresist is stripped from the surface, then an accelerator is used to prepare the metal and resin activated resistor area, and then the resisto...

Embodiment II

[0054] Copper-coated laminates are processed in the following sequence:

[0055] 1) Laminate a liquid or dry film on both copper surfaces of the laminate;

[0056] 2) exposing and developing the resist so that the desired circuit is protected and the resistor area is exposed;

[0057] 3) Print and etch the resistor area and desired circuit diagram;

[0058] 4) stripping the photoresist from the surface;

[0059] 5) Adjust the surface of the plate;

[0060] 6) Coat the surface of the plate with additional liquid or dry film photoresist;

[0061] 7) exposing and developing the resist to expose the resistor area and part of the adjacent copper circuitry;

[0062] 8) activation plate; and

[0063] 9) Strip the photoresist from the surface, then use the accelerator to prepare the metal and resin activated resistor area, then electrolessly plate the resistor and circuit pattern with the resistive material until the thickness of the predetermined resistor value is produced.

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PUM

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Abstract

The present invention is a process for manufacturing resistors integral with the printed circuit board by plating the resistors onto the insulative substrate. The invention uses a mask during the activation step so as to selectively activate only selected portions of the surface thus enabling smaller areas to be plated on the printed circuit board because no plating mask is used. The process of the present invention produced printed circuit boards having greater uniformity and reliability as compared to the prior art.

Description

technical field [0001] The invention relates to a method of manufacturing double-sided or multilayer printed circuit boards with integral plated resistors. The proposed method of the present invention selectively activates exposed areas of a metal-clad laminate to receive plating thereon during the manufacture of printed circuit boards. The method of the present invention does not use a plating mask, thus allowing smaller areas to be plated onto the printed circuit board. The method of the invention also achieves other advantages compared to the prior art. Background technique [0002] When manufacturing printed circuits, it is common to provide a flat plate with circuitry on each side. Boards comprising an integrally flat laminate of an insulating substrate and conductive metal are also commonly manufactured, wherein in a structure having an exposed surface of the laminate containing a printed circuit pattern, along the direction of the inner plate, there are, one or mul...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/16C23C18/32C23C18/42H01C17/06H05K1/16H05K3/18H05K3/24H05K3/28
CPCH01C17/06C23C18/1605C23C18/1651C23C18/32C23C18/42H05K1/167H05K3/184H05K3/244H05K3/28H05K2203/0565H05K2203/1453
Inventor 彼得·库坎斯基斯弗兰克·杜尔索戴维·萨沃斯卡
Owner MACDERMID INC
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