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Heat curable adhesive composition, article, semiconductor apparatus and method

A technology of semiconductors and adhesives, applied in chemical instruments and methods, semiconductor devices, semiconductor/solid-state device manufacturing, etc., can solve problems such as damage to chips, damage, etc., and achieve the effect of good heat resistance and high shear strength

Inactive Publication Date: 2005-08-31
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Sliced ​​chips may be damaged due to residual pressure-sensitive adhesive strength
In particular, for chips with abraded thickness of 100 microns or less, damage during the pick-up process is a serious problem

Method used

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  • Heat curable adhesive composition, article, semiconductor apparatus and method
  • Heat curable adhesive composition, article, semiconductor apparatus and method
  • Heat curable adhesive composition, article, semiconductor apparatus and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0090] The invention is described below with reference to preferred embodiments, which are summarized below:

[0091] (Embodiment 1) A heat-curable adhesive composition comprising: a caprolactone-modified epoxy resin; and a tack-weakening component.

[0092] (Embodiment 2) The heat curable adhesive composition according to Embodiment 1, wherein said tack-weakening component is a tack-weakening ingredient.

[0093] (Embodiment 3) The heat curable adhesive composition according to Embodiment 2, wherein the tack-weakening component is a melamine / isocyanuric acid adduct.

[0094] (Embodiment 4) The heat-curable adhesive composition according to any one of Embodiments 1-3, wherein the caprolactone-modified epoxy resin has an epoxy equivalent of 100-9000.

[0095] (Embodiment 5) The heat curable adhesive composition according to Embodiment 3, wherein the content of the melamine / isocyanuric acid adduct is 1 to 200 parts by weight.

[0096] (Embodiment 6) The heat curable adhesive c...

Embodiment approach 11

[0101] (Embodiment 11) An adhesive article comprising a heat curable adhesive layer of a heat curable adhesive composition and a backing layer carrying the adhesive layer on at least a part of the backing layer, wherein The thermally curable adhesive composition includes a caprolactone-modified epoxy resin and a tack-weakening component.

[0102] (Embodiment 12) The adhesive article according to Embodiment 11, wherein said tack-weakening component is an tack-weakening compound.

[0103] (Embodiment 13) The adhesive article according to Embodiment 12, wherein the adhesion-weakening compound is a melamine / isocyanuric acid adduct.

[0104] (Embodiment 14) The adhesive article according to any one of Embodiments 11-13, wherein in the heat-curable adhesive composition, the caprolactone-modified epoxy resin has epoxy The equivalent is 100-9000.

[0105] (Embodiment 15) The adhesive article according to any one of Embodiments 11 to 14, wherein in the heat curable adhesive compositi...

Embodiment approach 23

[0113] (Embodiment 23) A semiconductor device comprising a substrate on which at least one semiconductor element is mounted, characterized in that said semiconductor element is bonded thermally curable by a thermally curable adhesive composition A layer is secured to the surface of the substrate, the heat curable adhesive composition comprising a caprolactone modified epoxy resin and an adhesion reducing component.

[0114] (Embodiment 24) The semiconductor device according to Embodiment 23, wherein said semiconductor element is fixed to said substrate by thermal bonding via said heat-curable adhesive layer. The initial adhesive strength of the heat curable adhesive layer is increased by heating.

[0115] (Embodiment 25) The semiconductor device according to Embodiment 23 or 24, wherein the heat-curable adhesive layer is derived from the heat-curable adhesive composition according to any one of Embodiments 1-10 come out.

[0116] (Embodiment 26) The semiconductor device acco...

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Abstract

Provided are a heat curable adhesive composition and an adhesive article suited for dicing of a semiconductor and die-bonding of the diced semiconductor chip, and a semiconductor apparatus and a process for preparing a semiconductor apparatus using the adhesive composition and article. In one embodiment, the present invention provides a heat curable adhesive composition comprising a caprolactone-modified epoxy resin and a tack reducing component. Another embodiment of the present invention provides an adhesive article comprising a heat curable adhesive layer of a heat curable adhesive composition comprising a caprolactone-modified epoxy resin, a tack reducing component, and a backing layer carrying said adhesive layer on at least a portion of the backing layer.

Description

field of invention [0001] The present invention relates to a heat curable adhesive composition, an adhesive film (i.e. a film form of an adhesive using the heat curable adhesive composition), and an adhesive article (i.e. a A backing material having a heat curable adhesive composition thereon). The present invention also relates to a semiconductor device and a method of producing the same using such an adhesive film or an adhesive article. technical background [0002] Epoxy resins are well known as an example of heat curable resins having excellent bond strength. Therefore, epoxy resins are widely used as a main component of heat-curable adhesive compositions. [0003] When the heat-curable adhesive composition includes a typical epoxy resin, it generally exhibits its adhesive strength only after it is hardened by being heat-cured, and the adhesive strength before heat-setting is low. In other words, generally such heat curable adhesive compositions have substantially no...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/00C08L21/00C08L25/14C08L33/00C08L71/12C08L79/08C09J7/22C09J7/35C09J163/00H01L21/301H01L21/52H01L21/58H01L21/68H01L21/683H01L21/78H01L23/31
CPCC08L25/14C08L2205/035C09J2463/00H01L2924/01045H01L24/32H01L21/6836H01L2924/15311H01L23/3128C08L71/12H01L2224/29H01L2924/19041H01L2224/48091H01L2924/01013C09J163/00H01L2224/29298H01L2224/32225H01L2224/92247H01L2924/0665H01L2224/2919C09J7/0242H01L2224/48247H01L24/83H01L2924/01033H01L2224/32145H01L2924/01078H01L2924/01051H01L2924/01015H01L2924/01023H01L2924/01082H01L2221/68327C08L21/00H01L21/78H01L2924/01019H01L2924/01029H01L2924/00013H01L2924/01027H01L2224/48472H01L2924/014C08L33/00H01L2224/29101H01L2224/45147H01L2224/83191H01L24/27H01L2224/83855H01L2924/01079H01L2224/48465H01L2924/01061H01L2224/48227H01L2924/14H01L24/29H01L2924/01005H01L2924/01006H01L2924/01011H01L2924/10253H01L2924/01075H01L2224/73265H01L2924/07802C08L79/08H01L2924/12044H01L2924/181H01L24/73H01L2224/45144H01L2924/00011C09J7/35C09J7/22C08L2666/02H01L2224/2612H01L2924/00014H01L2924/00H01L2924/00012H01L2924/3512H01L2224/29099H01L2224/29199H01L2224/29299H01L2224/2929C09J11/06
Inventor 竹内省二川手恒一郎榊原诚
Owner 3M INNOVATIVE PROPERTIES CO
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