Heat curable adhesive composition, article, semiconductor apparatus and method
A technology of semiconductors and adhesives, applied in chemical instruments and methods, semiconductor devices, semiconductor/solid-state device manufacturing, etc., can solve problems such as damage to chips, damage, etc., and achieve the effect of good heat resistance and high shear strength
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[0090] The invention is described below with reference to preferred embodiments, which are summarized below:
[0091] (Embodiment 1) A heat-curable adhesive composition comprising: a caprolactone-modified epoxy resin; and a tack-weakening component.
[0092] (Embodiment 2) The heat curable adhesive composition according to Embodiment 1, wherein said tack-weakening component is a tack-weakening ingredient.
[0093] (Embodiment 3) The heat curable adhesive composition according to Embodiment 2, wherein the tack-weakening component is a melamine / isocyanuric acid adduct.
[0094] (Embodiment 4) The heat-curable adhesive composition according to any one of Embodiments 1-3, wherein the caprolactone-modified epoxy resin has an epoxy equivalent of 100-9000.
[0095] (Embodiment 5) The heat curable adhesive composition according to Embodiment 3, wherein the content of the melamine / isocyanuric acid adduct is 1 to 200 parts by weight.
[0096] (Embodiment 6) The heat curable adhesive c...
Embodiment approach 11
[0101] (Embodiment 11) An adhesive article comprising a heat curable adhesive layer of a heat curable adhesive composition and a backing layer carrying the adhesive layer on at least a part of the backing layer, wherein The thermally curable adhesive composition includes a caprolactone-modified epoxy resin and a tack-weakening component.
[0102] (Embodiment 12) The adhesive article according to Embodiment 11, wherein said tack-weakening component is an tack-weakening compound.
[0103] (Embodiment 13) The adhesive article according to Embodiment 12, wherein the adhesion-weakening compound is a melamine / isocyanuric acid adduct.
[0104] (Embodiment 14) The adhesive article according to any one of Embodiments 11-13, wherein in the heat-curable adhesive composition, the caprolactone-modified epoxy resin has epoxy The equivalent is 100-9000.
[0105] (Embodiment 15) The adhesive article according to any one of Embodiments 11 to 14, wherein in the heat curable adhesive compositi...
Embodiment approach 23
[0113] (Embodiment 23) A semiconductor device comprising a substrate on which at least one semiconductor element is mounted, characterized in that said semiconductor element is bonded thermally curable by a thermally curable adhesive composition A layer is secured to the surface of the substrate, the heat curable adhesive composition comprising a caprolactone modified epoxy resin and an adhesion reducing component.
[0114] (Embodiment 24) The semiconductor device according to Embodiment 23, wherein said semiconductor element is fixed to said substrate by thermal bonding via said heat-curable adhesive layer. The initial adhesive strength of the heat curable adhesive layer is increased by heating.
[0115] (Embodiment 25) The semiconductor device according to Embodiment 23 or 24, wherein the heat-curable adhesive layer is derived from the heat-curable adhesive composition according to any one of Embodiments 1-10 come out.
[0116] (Embodiment 26) The semiconductor device acco...
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