Semiconductor device and producing method, semiconductor package, electronic device and producing method, electronic instrment
A technology of electronic equipment and semiconductors, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc.
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[0061] Hereinafter, semiconductor devices, electronic devices and their manufacturing methods according to embodiments of the present invention will be described with reference to the drawings.
[0062] figure 1 It is a cross-sectional view showing the structure of the semiconductor device according to the first embodiment of the present invention.
[0063] In the first embodiment, the opening diameters of both the openings 13a, 13b and the openings 22a, 22b of the semiconductor packages PK11, PK12 to which the protruding electrodes 29a, 29b are bonded are changed.
[0064] exist figure 1 Among them, a carrier substrate 11 is provided on the semiconductor package PK11. Furthermore, a land surface 14 for disposing the protruding electrodes 19 is provided on the inner surface of the carrier substrate 11 . In addition, an insulating film 12 such as a solder resist is formed on the back surface of the carrier substrate 11 on which the land 14 is provided, and an opening 12 a ex...
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