Signal transmission structure

Abstract

The present invention relates to a signal transmission structure, mainly including reference plane, combination pad, conductive wire and conductive ball. The signal transmission structure utilizes the change of the form of the reference plane or conductive wire to relatively reduce the equivalent capacity of thue conductive ball and its adjacent signal path or relatively raise the equivalent induction of the conductive ball and its adjacent signal path so as to compensate the high equivalent capacity between the conductive ball and reference plane, and can make the conductive ball and its adjacent signal path have the better impedance matching to raise the completeness of the signal after which is passed through the conductive ball and its adjacent signal path.

Description

technical field [0001] The present invention relates to a signal transmission structure, and more particularly to a signal transmission structure suitable for a signal transmission medium for improving the impedance mismatch of a signal transmission path. Background technique [0002] With the rapid development of the electronic technology industry, various electronic products with different functions have gradually penetrated into our work and life. Electronic products are usually equipped with a motherboard, which includes a circuit board and a plurality of electronic components, and these electronic components are assembled on the circuit board and electrically connected to each other through the internal circuits of the circuit carrier board to provide electronic products. The designed function, wherein these electronic components also include integrated circuit (Integrated Circuit, IC for short) components. In order to effectively protect the fragile IC die and at the ...

AI Technical Summary

Problems solved by technology

[0005] Please refer to Figure 1A , Figure 1B , when the signal passes through the conductive wire 130, the bonding pad 120, the conductive ball 140, the bonding pad 12a and the conductive wire 12b, due to the geometry of the conductive ball 140 itself, a discontinuous low voltage is generated between the conductive ball 140 and the reference plane 110 Impedance characteristics, thus resulting in the phenomenon of impedance mismatch in the adjacent signal path of the conductive ball 140

Therefore, when the signal passes through the adjacent signal path of the conductive ball 140, the signal will be reflected, resulting in that the signal cannot be completely transmitted from one signal receiving end to another signal receiving end through the conductive ball 140.

In addition, as the operating frequency of the signal increases, when the signal passes through the conductive ball 140, the return loss of the signal will become relatively smaller, and the insertion loss of the signal will also become relatively obvious. Large, so that the degree of impedance mismatch in the adjacent signal path of the conductive ball 140 is more obvious, which is quite unfavorable for the transmission of high-frequency signals

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