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Radiator

A radiator and heat sink technology, applied in the fields of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of vibration testing, crushed microprocessors, and overweight products, and achieve the effect of light weight

Inactive Publication Date: 2004-01-14
INVENTEC CORP
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  • Abstract
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Problems solved by technology

[0005] Due to the higher specific heat of metal copper, copper is currently used as the material of the heat sink (no matter it is the heat sink 40 or the substrate 50), but when the above-mentioned heat sink is enlarged, the density of copper (8.9 g / cm 3 ) will also cause the microprocessor to carry a large pressure. In addition to the risk of crushing the microprocessor, it will also cause problems in shock and vibration tests, and even make the product too heavy

Method used

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Embodiment Construction

[0015] Such as image 3 , Figure 4 and Figure 5 As shown, the radiator according to the present invention is applied to the heat dissipation of microprocessors, and includes a heat sink 10, an adhesive medium 20 and a substrate 30, wherein the material of the heat sink 10 is metal copper, and it is sheet-shaped , the material of the bonding medium 20 can be any metal whose specific heat is at least equivalent to that of copper, and it is in the shape of a plate, and the material of the substrate 30 is a metal matrix composite material, and the non-metallic material therein has a lower density than the metal material , and has very good thermal conductivity. Here, the mixture of metal aluminum and silicon carbide in the aluminum matrix composite material is taken as an example, wherein the metal aluminum accounts for 60-70% or 65-75% of the weight of the substrate 30, while the silicon carbide Compared with metal aluminum, which accounts for 30~40% or 25~35% of the weight o...

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Abstract

The invention discloses a radiator used for the radiation of a micro processor comprising radiating fins, binding mediator and substrate, wherein the radiating fins are sheet-like, and each radiating fin is spaced and pasted to the sheet-like binding mediator perpendicularly, while the substrate is also plate-like corresponding to the binding mediator whose material quality is aluminum based composite material, it is pasted to the binding mediator an a face-to-face manner. The radiator by the invention possesses both high thermoconductivity and light weight, and it does not influence the impact and vibration-testing for it.

Description

technical field [0001] The invention relates to a radiator, in particular to a radiator applied to a microprocessor. Background technique [0002] In the design of the original computer, there is no other related heat dissipation design except for the fan of the power supply itself to assist the computer host to dissipate heat. As the speed increases, more heat will be dissipated. As a result, the temperature of the computer system will remain relatively high. Therefore, a proper heat dissipation device must be installed in the computer system to ensure the stable operation of the computer system. [0003] In order to ensure the stable operation of the computer system, computer components that generate heat in the computer system are generally designed with a heat dissipation function. For components that emit less heat, radiators can be used directly, while components that emit higher heat (such as micro Processor) can use the radiator to cooperate with the fan to implemen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 林书如
Owner INVENTEC CORP
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