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Surface fitting device package lead connecting method

A wire bonding and wire bonding technology, applied in the field of new wire bonding, can solve problems such as misalignment, complicated manufacturing process, easy damage or cracking

Inactive Publication Date: 2003-01-08
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned problems complicate the manufacturing process of the package
[0014] In addition, graphite fixtures made of graphite materials have poor mechanical strength and are easily damaged or broken
Especially at Figure 2c Broken part "B" in the stepped part shown in will inevitably lead to misalignment
In other words, since the lead positioning groove and the package positioning groove cannot be properly formed, the lead or the package cannot be expected to have a desired position.
[0015] As mentioned above, according to the prior art SMD package bonding method, such misalignment occurs frequently in various forms, so it is difficult to find a solution
Also, when the stepped structure is damaged, the graphite jig should be replaced with a new one, thus increasing the product cost

Method used

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  • Surface fitting device package lead connecting method
  • Surface fitting device package lead connecting method
  • Surface fitting device package lead connecting method

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Embodiment Construction

[0029] A wire bonding method for an SMD package according to the present invention will be described in detail below.

[0030] Figures 3a to 3d Schematic representation of the steps of a wire bonding method for an SMD package. First, if Figure 3a As shown in , the package 25 is arranged in the positioning groove of the support table 42 to allow the lead positioning surface of the package 25 on which the leads are positioned to face upward. The supporting platform 42 is made of common non-magnetic material or graphite material, and has a plurality of positioning grooves. Each positioning groove of the support platform 42 does not have to have the same size as the package or have a stepped structure like the positioning grooves of a conventional graphite jig. Therefore, the jig of the present invention can be easily manufactured and can prevent misalignment due to breakage of the stepped structure.

[0031] Such as Figure 3b As shown in , the leads 20 are positioned in t...

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Abstract

Disclosed herein is a lead bonding method for SMD packages. The lead bonding method includes the step of placing a package body with its lead-positioning surface facing upward. A lead with solder is arranged on the lead-positioning surface of the package body using vision system. The lead is spot-welded onto the package body to fix the lead to the package body. The package body spot-welded together with the lead is arranged in a positioning depression of a jig with the lead facing downward. The solder formed on the lead are melted to bond the lead to the package body.

Description

technical field [0001] The present invention relates to a wire bonding method for SMD packages, and in particular to a novel wire bonding method capable of correctly positioning the wires in the SMD package to completely avoid leakage. Background technique [0002] Those skilled in the art know that chip-embedded packages are usually used to quickly and easily mount devices with special functions, such as surface acoustic wave (SAW) filters, on a substrate. A chip embedded in a chip-embedded package is electrically connected to a substrate through leads provided in the package. Chip-embedded packages are generally classified into pin-type packages or surface-mount device (SMD) packages, in which the leads of the pin-type package protrude from the package body and are soldered on the substrate, and the surface-mount device (SMD) package can be inserted into the substrate formed on the substrate. in the groove on the bottom. [0003] Such an SMD package is generally classifi...

Claims

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Application Information

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IPC IPC(8): H01L23/50H01L21/60H01L21/68H01L23/48
CPCH01L2924/01074H01L2924/01051H01L2224/13111H01L2924/01005H01L2924/01082H01L2924/014H01L24/80H01L2924/01004H01L21/6835H01L2924/01006H01L2924/01078H01L2924/01033Y10T29/4913H01L2924/01079H01L23/48
Inventor 郑钟声金钟泰尹锦荣金昌德
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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