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Electret condenser microphone

A technology of electret and pickup, which is applied in the field of hybrid electret capacitor pickup, which can solve the problems of inability to miniaturize, poor electrical contact, and inability to expand production volume, etc.

Inactive Publication Date: 2002-11-20
BSE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this reason, although the electret condenser pickup can significantly improve performance, it has a problem that it cannot be miniaturized
Another problem is that the contact area between the input terminal 10 of the amplifier unit 9 and the fixed electrode 16 is limited, so that poor electrical contact occurs between the input terminal 10 of the amplifier unit 9 and the fixed electrode 16, so that the production volume cannot be expanded.

Method used

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  • Electret condenser microphone
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Examples

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Embodiment Construction

[0014] Hereinafter, an electret condenser pickup according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

[0015] figure 2 is a perspective view schematically showing the appearance of an electret condenser pickup according to a preferred embodiment of the present invention; image 3 is a partial cross-sectional view showing an electret condenser pickup according to a preferred embodiment of the present invention; Figure 4 is a perspective view schematically showing a diaphragm used in an electret condenser pickup according to a preferred embodiment of the present invention; and Figure 5 is a perspective view showing a silicon fixed plate in which IC devices used in the electret capacitor pickup according to a preferred embodiment of the present invention are integrated on a chip.

[0016] refer to Figures 2 to 5 , the electret capacitor pickup according to a preferred embodiment of the present inventio...

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Abstract

The invention relates to an electret capacitor pickup, comprising: a vibrating diaphragm composed of an electret thin film charged with electric charges; a conductive thin film formed on one side of the electret thin film by sputtering or chemical vapor deposition; and a polar ring arranged on the peripheral edge of the lower side of the conductive film to separate the conductive film formed on the electret film and the inner bottom surface of the casing by a given distance. In addition, the pickup includes a diaphragm support that is on the diaphragm and has grooves and recesses. The concave portion has a plurality of sound holes formed on the bottom surface thereof, so that the vibrating diaphragm is easily vibrated. An integrated circuit is connected to the vibrating diaphragm support to receive and amplify the converted electrical signals from the vibrating diaphragm. Additionally, the pickup includes an insulating cap on which a pair of contact pins are positioned. The electret capacitor pickup of the present invention has a simple structure and reduced assembly steps, thereby enabling miniaturization, improving productivity, and reducing manufacturing costs.

Description

technical field [0001] The present invention generally relates to a hybrid electret condenser pickup, more particularly, relates to a miniaturized electret condenser pickup for use in portable telephones or information communication devices, including components such as IC devices, etc. The main components of the electronic circuit are integrated into the chip. Background technique [0002] Korean Patent Application No. 1993-3063 filed on December 22, 1990 and granted on April 17, 1993 in the name of the present applicant discloses an electret capacitor pickup which is fixed to a microphone, telephone, portable On telephones, video recorders, toys, etc., to convert sound pressure into electrical signals. [0003] figure 1 The electret condenser pickup disclosed in this patent is schematically shown in cross-section in . Such as figure 1 As shown, the electret condenser pickup includes a housing 3 having an opening 1 formed in a central portion of...

Claims

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Application Information

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IPC IPC(8): H04R1/04H04R19/01H04R19/04
CPCH04R1/04H04R19/016H04R19/04Y10T29/43Y10T29/49005
Inventor 尹斗映朴成镐
Owner BSE CO LTD
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