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Adaptive probe device

A technology of probes and microelectronic devices, applied in the field of adaptable probe devices, to achieve reliable testing and enhanced testing functions, improve production efficiency, and reduce size

Inactive Publication Date: 2002-06-05
菲康姆株式会社
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] The methods listed above and others have been unsuccessful in providing high performance probes that enable economical hardening and rapid testing of microelectronic devices on wafers before the wafers are diced into discrete chips

Method used

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Examples

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Embodiment Construction

[0052] In accordance with the principles of the present invention, a first preferred embodiment of an adaptable probe is shown in Figure 5 . The disclosed probes allow reliable electrical connections to be made on contact pads of microelectronic devices such as integrated circuits (ICs), flip-bonded chips, passive devices, and chip-scale packages. The probe provides elastic vertical movement of the probe tip 81 in response to a force on the tip. Thus, when the contact pad is urged into contact with the probe tip 81, the mechanical bending of the structure allows the tip to come into contact with the mating contact pad with a force sufficient to cause the probe tip 81 to penetrate the pad on the pad. insulating oxide film. The mechanical flexing of the probes accommodates the height variation of the contact pads in the microelectronic device area, while providing sufficient force on each probe tip to ensure a reliable electrical connection between the tip and the correspondi...

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Abstract

A mechanically compliant probe for electrically connecting to contact pads on microelectronic devices. The probe can be used for burn-in of integrated circuits at the wafer level. Additional applications include probe cards for testing integrated circuits and sockets for flip-chips. One configuration of the probe includes a probe tip, which is held on an extension arm projecting laterlaly from an elongated flat spring. The spring is supported above a substrate by posts such that the probe tip of free to move vertically in response to a contact force on the probe tip. Deflection of the probe tip of compliantly limited by bending and torsional flexure of the sheet spring. Mechanical compliance of the tip allows arrays of the probe to contact pads on integrated circuits where the pads are not precisely planar.

Description

[0001] Cross References to Related Applications [0002] This application utilizes the co-pending application entitled "Contacting Device". technical field [0003] The present invention relates to burn-in and inspection of microelectronic devices, and in particular to contact assemblies used to connect electrical signals to integrated circuits during burn-in and testing of individual chips and entire wafers. Background technique [0004] During production, microelectronic devices are subjected to a series of testing procedures to verify functionality and reliability. The testing process typically includes wafer probe testing, in which microelectronic device chips are tested before they are diced from the wafer and packaged to determine the operation of each chip. Probe cards made of long cantilever wires are used to test one or several chips at the wafer level. [0005] Typically, during wafer probe...

Claims

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Application Information

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IPC IPC(8): G01R31/26G01R1/067G01R1/073H01L21/66
CPCG01R1/07314G01R1/06727G01R1/06738H01L22/00
Inventor 迪斯蒂法诺·托马斯·H
Owner 菲康姆株式会社
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