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Wet type processing device

A technology of wet treatment and liquid treatment, which is applied in the direction of cleaning methods using liquids, cleaning methods and utensils, chemical instruments and methods, etc., which can solve the problems of increased usage of washing liquid and achieve the effect of reducing treatment costs

Inactive Publication Date: 2002-03-20
ALPS ALPINE CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when using conventional general cleaning nozzles, there is a problem that the amount of cleaning liquid used increases.

Method used

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Examples

Experimental program
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Embodiment Construction

[0044] Below, refer to Figure 1 to Figure 10 The first embodiment of the present invention will be described.

[0045] figure 1 It is a plan view showing the general structure of the cleaning device (wet processing device) of this embodiment. Such as figure 1 As shown, the cleaning apparatus of this embodiment is constituted by the following mechanism, that is, the nozzle 1 for cleaning and the substrate W (hereinafter referred to as the substrate) as the object to be processed are moved to the moving direction A or A'. Mechanism (not shown in the figure) and, washing liquid introduction recovery mechanism 30 and, washing liquid preparation mechanism 50.

[0046] exist figure 1 In the figure, reference numeral 31 is an introduction flow path of the washing liquid introduction and recovery mechanism 30, which is divided into two flow paths at the end and connected to the nozzle 1 for washing. In addition, reference numeral 32 is a recovery flow channel for introducing the...

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PUM

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Abstract

A wet treatment apparatus includes a nozzle having an approximately rectangular introduction opening surface (8a) which is open toward a substrate (W) to be treated and an approximately rectangular recovery opening surface (9a) which is open toward the substrate, these opening surfaces being flush with each other and disposed with the long side directions thereof in parallel with each other. A treatment liquid (L) is introduced between the introduction opening surface and the surface to be treated of the substrate and sucked and recovered from between the recovery opening surface and the surface to be treated of the substrate. At this time, the flow rate of the treatment liquid flowing from the introduction opening surface to the recovery opening surface through the surface to be treated of the substrate is controlled to 0.02 to 0.3 L / min per 1 cm in the long side direction of the introduction opening surface.

Description

technical field [0001] The present invention relates to a wet processing apparatus for supplying a processing liquid to an object to be processed, for example, in wet processing steps such as washing and etching in the manufacturing process of semiconductor devices and liquid crystal display panels. Background technique [0002] In the field of electronic devices such as semiconductor devices and liquid crystal display panels, a process of washing semiconductor substrates or glass substrates to be processed must be included in the manufacturing process. In the cleaning process, various substances to be removed are removed, and various cleaning solutions such as ultrapure water, electrolytic ionized water, ozone water, and hydrogen water are used for cleaning, but these cleaning solutions are supplied to the substrate from the nozzle of the cleaning device . However, there is a problem that the amount of washing liquid used increases when a conventional general washing nozzl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/02B08B3/04B08B3/12H01L21/00H01L21/304
CPCB08B3/041H01L21/67051B08B3/123H01L21/6708H01L21/67057H01L21/67086H01L21/304
Inventor 三森健一大见忠弘
Owner ALPS ALPINE CO LTD
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