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Flat curved type heat pipe integrated heat radiator for electron element

A technology that integrates heat sinks and electronic components. It is applied in electrical components, electrical solid devices, indirect heat exchangers, etc. It can solve problems such as affecting heat dissipation, and achieve the effect of large contact area, large heat dissipation, and reduced thermal resistance.

Inactive Publication Date: 2007-06-06
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, no matter what kind of capillary layer is in the condensation place, a thick liquid film is formed, which will form thermal resistance and affect heat dissipation

Method used

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  • Flat curved type heat pipe integrated heat radiator for electron element
  • Flat curved type heat pipe integrated heat radiator for electron element
  • Flat curved type heat pipe integrated heat radiator for electron element

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Manufacture the integrated radiator in the form of Figures 1, 2, and 3. A rectangular copper tube with a wall thickness of 0.5mm and a cross-sectional size of 40×5mm, with a length of 150mm, is bent into a U-shaped tube blank with a middle distance of 40mm and a height of 50mm according to Figure 2. Put the tube blank into the mold for hydroelectric forming, and shape it into a U-shaped flat tube 2. The straight section of the U-shaped tube becomes a flat ring shape of 45×5mm, and the contact with the electronic component 1 becomes 45mm wide. One side is 5mm, one side is a 7mm drop-shaped section (aspect ratio of 45 / 7=6.43), and the straight section of the U-shaped tube forms an angle of 2.8° with the normal direction of the bottom surface. Put 3~5g 100(mesh copper powder in the heating part of the U tube, cover both sides with 1.5mm reinforcing copper sheet 7, and then punch the punched 0.3mm thick copper fin 3, and clamp it at a distance of 0.5~0.8mm Install it on th...

Embodiment 2

[0023]Manufacture the integrated radiator in the form of Figures 1, 2, and 3. A rectangular copper pipe with a wall thickness of 0.5mm and a cross-sectional size of 20×5mm, with a length of 150mm, is bent into a U-shaped pipe blank with a middle distance of 40mm and a height of 50mm according to Figure 2. Put the tube blank into the mold for hydroelectric forming, and shape it into a U-shaped flat tube 2. The straight section of the U-shaped tube becomes a flat ring shape of 25×5mm, and the contact with the electronic component 1 becomes 25mm wide. One side is 5mm, one side is a 7mm drop-shaped section (aspect ratio of 25 / 7=3.57), and the straight section of the U-shaped tube forms an angle of 4.6° with the normal direction of the bottom surface. Put 3-5g of 100-mesh copper powder into the heating part of the U tube, cover both sides with 1.5mm reinforcing copper sheet 7, coat silver-copper solder on all parts to be welded, put it into a vacuum furnace, and heat it at 800-850°...

Embodiment 3

[0025] Manufacture the integrated radiator in the form of Figures 4 and 5. Take a rectangular copper tube with a wall thickness of 1mm and a cross-sectional size of 25×5mm, and a length of 300mm. According to Figure 4, bend it into a coil blank with a middle spacing of 30mm, an outer spacing of 25mm, and a height of 50mm. Seal one end of the coiled tube, and connect the other end with a pressure tube, put it into the mold and add 40MPa of water pressure to shape it into a flat coiled tube 2. ×8mm rectangular section (aspect ratio of 26 / 8=3.25); put 3~5g of 100 mesh copper powder into the heating part of the snake tube, and then punch the punched 0.3mm thick copper fin 3, press 0.5~ 0.8mm spacing is clamped on the snake tube, silver-copper solder is coated on the part to be welded, placed in a vacuum furnace, and the brazing fins are heated at 800-850°C and copper powder is sintered; both ends of the copper tube are sealed and soldered, and the soldering liquid is returned Pip...

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Abstract

The invention provides a flat and bent hot-tube type integrated cooler for electronic components. It directly contacts the electronic components by a fin-free part of the flat tube, the inner surface of the fin-free part is completely dipped by a phase-variable heat-conducting liquid working medium, the heat emitted from the electronic components is completely transmitted to the liquid working medium in the direction of the wall thickness of the flat tube so as to evaporate the working medium, the gas working medium condenses in the flat tube, the condensed liquid working medium flows back to a heating part, and as the working medium condenses in the flat tube, the heat is transmitted to the fins. It is applied to cooling electronic components with a high heat-flow density, like CPUs, high power rectifier tubes, etc. it can be placed, horizontally and laterally and as it is placed laterally, the heat conducting ability does not change. In addition, it has another advantage of shorter seal welding line, thus convenient to implement high-quality sealing of hot tubes and increase product yield.

Description

technical field [0001] The invention belongs to the technical field of electronic heat dissipation, and in particular relates to an integrated radiator of heat pipes and fins used for heat dissipation of electronic components. Background technique [0002] As the operating frequency and integration of computer CPUs continue to increase, the heat flow generated by them continues to increase, which is the main reason for limiting the operating speed and stability of the CPU. In other electronic devices, such as high-power rectifier circuits, heat dissipation is also very important. If the heat dissipation of electronic components is not good, the high temperature generated during operation will make the electronic components work unstable or even burn out. [0003] The usual heat dissipation method for electronic components is to use extruded aluminum alloy radiators, followed by pure copper radiators and copper-aluminum composite radiators. Since the heat dissipation of the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/427
CPCH01L2924/0002F28D15/0233F28D15/0266F28D15/0275H01L2924/00
Inventor 白敏丽李晓杰
Owner DALIAN UNIV OF TECH
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