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Power semiconductor module

A power semiconductor and semiconductor technology, which is applied to output power conversion devices, cooling/ventilation/heating transformation, chassis/cabinet/drawer parts, etc. Flexibility and convenience, simple mechanical linkage, longevity effect

Pending Publication Date: 2022-08-02
富芯微电子有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, most power semiconductor modules on the market are not designed with an external blocking mechanism that can block the inside of the semiconductor module. Such a setting makes it impossible to block the internal chips of the semiconductor module in time Carry out protection, propose a kind of power semiconductor module to solve the above-mentioned existing problems for this reason

Method used

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Embodiment Construction

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0028] It should be noted that in the description of the present invention, the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", The orientation or positional relationship indicated by "bottom", "inside", "outside", etc. is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying...

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Abstract

The invention discloses a power semiconductor module, and relates to the technical field of semiconductors. Comprising a storage box, one side of the outer portion of the storage box is fixedly connected with an electrifying connector, one end of the inner portion of the storage box is fixedly connected with an output seat, a semiconductor chip is installed at the center point position of the inner portion of the storage box, and the electrifying connector, the semiconductor chip and the output seat are sequentially communicated through a transmission wire harness. An adjusting mechanism is arranged on the transmission wire harness between the power-on connector and the semiconductor chip. According to the power semiconductor module, the adjusting mechanism similar to a cam lifting mechanism is installed in a common power semiconductor module, and the adjusting mechanism is connected with the control panel outside the semiconductor module, so that a user can rotate the control panel to block and cut off current introduced into the semiconductor module; the internal chip of the power semiconductor module is protected through simple mechanical linkage, and the flexibility and convenience of the device in actual use are improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a power semiconductor module. Background technique [0002] Power semiconductor modules are the core devices in power electronic devices. Power semiconductor modules are mainly composed of insulated gate bipolar transistor devices, which have the advantages of simple control, high voltage and high current, high frequency and low loss. [0003] At present, most power semiconductor modules on the market are designed to set a blocking mechanism inside the semiconductor module outside of it. Such a setting makes it impossible to timely block the internal chips of the semiconductor module when the current flowing into the semiconductor module is too large. For protection, a power semiconductor module is proposed to solve the above-mentioned problems. SUMMARY OF THE INVENTION [0004] The purpose of the present invention is to provide a power semiconductor module to solve the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02H05K7/14H05K7/20H02M1/00
CPCH05K5/0217H05K5/0247H05K7/20136H02M1/00H05K7/14
Inventor 王全倪侠邹有彪张荣徐玉豹
Owner 富芯微电子有限公司
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