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Low-dielectric high-thermal-conductivity composite film and preparation method thereof

A composite thin film, high thermal conductivity technology, applied in the direction of climate change adaptation, etc., can solve the problems of easy electric shock, heat increase, easy conduction, etc., to reduce the possibility of leakage, improve dispersion, and reduce inertia.

Pending Publication Date: 2022-08-02
GUANGDONG SUQUN NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The composite film mainly refers to a film obtained by compounding two and / or more materials. At present, the film with heat conduction is mainly used for the heat dissipation of electronic products, such as the heat dissipation of mobile phones, computers, and new energy vehicles. Films mainly include metal heat dissipation, graphite, insulation and heat dissipation, etc. Among them, metal heat dissipation includes heat dissipation copper foil, heat dissipation aluminum foil, etc., graphite includes natural graphite sheet, artificial graphite sheet, graphene film, etc. Metal and graphite although It has a good heat dissipation effect, but the dielectric is high, and it is easy to conduct electricity, which makes it easy to get an electric shock when using electronic products for heat dissipation; and most of the heat dissipation of electronic products chooses heat dissipation films of insulation and heat conduction, but with the development of science and technology With the development of the Internet, people’s demand is increasing, the quality requirements of goods are also increasing, and the upgrading of electronic products is increasing day by day. For example, the mobile phone or computer that people often use. The current insulating and heat-conducting heat dissipation materials cannot be demanded, so it is imperative to study new heat dissipation materials

Method used

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  • Low-dielectric high-thermal-conductivity composite film and preparation method thereof
  • Low-dielectric high-thermal-conductivity composite film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0049] A modified boron nitride, comprising the following preparation steps:

[0050] Step 1: Weigh 0.2Kg of sodium pyrophosphate, 5Kg of sodium hydroxide and 1Kg of potassium hydroxide, dissolve them in 100Kg of water, heat to 55°C, add 20Kg of boron nitride while stirring, stir for 3 hours, filter with a suction filter pump, and The filter residue is placed in an oven for drying for 8 hours to obtain pretreated boron nitride;

[0051] Step 2: Weigh 0.3Kg of fatty alcohol polyoxyethylene ether, 30Kg of alcohol solution with a mass fraction of 55% and 5Kg of 4-methyl-2-pentanol, add all the pretreated boron nitride obtained in step 1, and put into ultrasonic Vibrate for 2Kgh, the frequency of ultrasonic waves is 40KHZ, filter with a suction filter pump, put the filter residue in an oven for drying for 6h, and obtain modified boron nitride.

preparation example 2

[0053] A modified boron nitride, comprising the following preparation steps:

[0054] Step 1: Weigh 0.3Kg of sodium pyrophosphate, 6Kg of sodium hydroxide and 2Kg of potassium hydroxide, dissolve them in 100Kg of water, heat to 65°C, add 25Kg of boron nitride while stirring, stir for 4h, filter with a suction filter pump, The filter residue is placed in an oven for drying for 8 hours to obtain pretreated boron nitride;

[0055] Step 2: Weigh 0.5Kg of fatty alcohol polyoxyethylene ether, 40Kg of alcohol solution with a mass fraction of 65% and 7Kg of 4-methyl-2-pentanol, add all the pretreated boron nitride obtained in step 1, and put it into ultrasonic Vibrate for 2.5h, the frequency of ultrasonic waves is 40KHZ, filter with suction filter pump, put the filter residue in an oven for drying for 6h, and obtain modified boron nitride.

preparation example 3

[0057] A modified boron nitride, comprising the following preparation steps:

[0058] Step 1: Weigh 0.3Kg of sodium pyrophosphate, 8Kg of sodium hydroxide and 3Kg of potassium hydroxide and dissolve them in 100Kg of water, heat to 75°C, add 30Kg of boron nitride while stirring, stir for 5h, filter with a suction filter pump, The filter residue is placed in an oven for drying for 6 hours to obtain pretreated boron nitride;

[0059] Step 2: Weigh 0.8Kg of fatty alcohol polyoxyethylene ether, 50Kg of alcohol solution with a mass fraction of 75% and 10Kg of 4-methyl-2-pentanol, add all the pretreated boron nitride obtained in step 1, and put it into ultrasonic Vibrate for 3 hours, the frequency of the ultrasonic wave is 40KHZ, filter with a suction filter pump, put the filter residue in an oven for drying for 6 hours, and obtain modified boron nitride.

[0060] Comparative Example of Preparation of Modified Boron Nitride

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Abstract

The invention relates to the technical field of composite films, in particular to a low-dielectric high-thermal-conductivity composite film and a preparation method thereof. Comprising the following raw materials in parts by weight: 50-70 parts of waterborne polyurethane, 5-8 parts of acrylic acid, 12-18 parts of heat-conducting filler, 0.3-0.5 part of a dispersing agent, 0.2-0.3 part of a defoaming agent, 0.05-0.1 part of a curing agent and 20-30 parts of water. The composite film has a good heat conduction effect and is low in dielectric.

Description

technical field [0001] The present application relates to the technical field of composite films, and more particularly, to a composite film with low dielectric and high thermal conductivity and a preparation method thereof. Background technique [0002] The composite film mainly refers to a film obtained by compounding two and / or more materials. At present, the film with thermal conductivity is mainly used for the heat dissipation of electronic products, such as the heat dissipation of mobile phones, computers, new energy vehicles, etc. Films mainly include metal heat dissipation, graphite, insulation heat dissipation, etc. Among them, metal heat dissipation includes heat dissipation copper foil, heat dissipation aluminum foil, etc. Graphite includes natural graphite sheet, artificial graphite sheet, graphene film, etc. It has a good heat dissipation effect, but the dielectric is high and it is easy to conduct electricity, which makes the possibility of electric shock easy ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F283/00C08F220/06C08K9/02C08K3/38C08K9/04C08K3/34C08K7/20C08K3/28C08J5/18C08L51/08
CPCC08F283/006C08K9/02C08K3/38C08K9/04C08K9/08C08K3/34C08K7/20C08K3/28C08J5/18C08K2003/385C08K2003/282C08J2351/08C08F220/06Y02A30/00
Inventor 杨应彬任泽明王号廖骁飞吴攀贺超张松李宏高任泽永潘锋芳
Owner GUANGDONG SUQUN NEW MATERIAL CO LTD
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