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Test piece arrangement structure and test substrate

A test piece and test group technology, applied in the direction of semiconductor/solid-state device testing/measurement, electrical components, semiconductor devices, etc., can solve the problems of uneven thickness of the vapor-deposited film, inaccurate test results, etc., and improve the thickness of the vapor-deposited film. Non-uniformity, accurate test results, and the effect of improving the uniformity of the thickness of the vapor-deposited film

Pending Publication Date: 2022-07-29
WUHAN TIANMA MICRO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the thickness of the evaporated film layer is uneven during the evaporation process of the test piece, it may lead to inaccurate test results

Method used

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  • Test piece arrangement structure and test substrate
  • Test piece arrangement structure and test substrate
  • Test piece arrangement structure and test substrate

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Embodiment Construction

[0038] Features and exemplary embodiments of various aspects of the present application are described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to those skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating examples of the present application.

[0039] It should be noted that the embodiments in the present application and the features of the embodiments may be combined with each other in the case of no conflict. The embodiments will be described in detail below with reference to the accompanying drawings.

[0040] Relational terms such as first and second, etc. are only used to distinguish one entity or operation from another and do not neces...

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PUM

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Abstract

The invention discloses a test piece arrangement structure and a test substrate. The test piece arrangement structure comprises a plurality of test groups, each test group comprises at least one test piece, the number of the test pieces in each test group is the same, the plurality of test groups are arranged around a virtual mark point, the test pieces are provided with patterned structures, and the patterned structures are arranged around the virtual mark point. Each test group is provided with at least one test piece with the same patterned structure, and the distances from the same patterned structures in the test groups to the virtual mark points are the same. The thickness of the film layer of each patterned structure obtained by performing evaporation by utilizing the evaporation equipment is relatively consistent, so that the thickness uniformity of the evaporation film layer of the same patterned structure of each test group is improved, and the phenomenon that the thickness of the evaporation film layer of the test piece in each test group is not uniform is improved to a certain extent. The test piece has enough film layer precision, so that a more accurate test result can be obtained when the test piece is used for testing.

Description

technical field [0001] The present application relates to the field of display technology, and in particular, to a test piece arrangement structure and a test substrate. Background technique [0002] With the rapid development of electronic technology, organic light-emitting diode (Organic Light Emitting Diode, OLED) and other display technologies have become research hotspots in the display field, and technicians can use test pieces to perform experiments and verifications on display technologies. [0003] For example, a test piece can be pre-fabricated before mass production, and the design, process and function of the display panel can be experimentally verified through the test piece. This method has the advantages of low cost, simple operation, and flexible process. The applicant believes that the test piece itself should have sufficient precision so that the test piece can accurately reflect the test results. If the thickness of the evaporated film on the test piece i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66H01L27/32
CPCH01L22/10H01L22/20H10K59/00
Inventor 李红翠雷志宏张梦兰
Owner WUHAN TIANMA MICRO ELECTRONICS CO LTD
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