Test piece arrangement structure and test substrate
A test piece and test group technology, applied in the direction of semiconductor/solid-state device testing/measurement, electrical components, semiconductor devices, etc., can solve the problems of uneven thickness of the vapor-deposited film, inaccurate test results, etc., and improve the thickness of the vapor-deposited film. Non-uniformity, accurate test results, and the effect of improving the uniformity of the thickness of the vapor-deposited film
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[0038] Features and exemplary embodiments of various aspects of the present application are described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to those skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating examples of the present application.
[0039] It should be noted that the embodiments in the present application and the features of the embodiments may be combined with each other in the case of no conflict. The embodiments will be described in detail below with reference to the accompanying drawings.
[0040] Relational terms such as first and second, etc. are only used to distinguish one entity or operation from another and do not neces...
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