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High-stripping-resistance electrolytic copper foil with uniform microscopic surface particles and preparation method of high-stripping-resistance electrolytic copper foil

A technology of electrolytic copper foil and copper foil, which is applied in the field of high anti-stripping electrolytic copper foil and its preparation, can solve the problems of uneven particle size of the plating layer, short circuit of the circuit, and residual copper, etc. Strength, the effect of increasing the adhesion area

Active Publication Date: 2022-07-15
东强(连州)铜箔有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The particle size of the coating on the M surface of the copper foil is uneven, there are some peaks of the wool foil without coating, or some coating particles are too large, which will make it difficult to completely etch the large particles on the PCB after surface treatment, resulting in residual copper.
After the residual copper appears, the residual copper is concentrated in the dense area of ​​the circuit board, which will cause a short circuit and seriously affect the quality of the printed circuit board

Method used

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  • High-stripping-resistance electrolytic copper foil with uniform microscopic surface particles and preparation method of high-stripping-resistance electrolytic copper foil
  • High-stripping-resistance electrolytic copper foil with uniform microscopic surface particles and preparation method of high-stripping-resistance electrolytic copper foil
  • High-stripping-resistance electrolytic copper foil with uniform microscopic surface particles and preparation method of high-stripping-resistance electrolytic copper foil

Examples

Experimental program
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Effect test

Embodiment 1

[0047] A high anti-stripping electrolytic copper foil with uniform microscopic surface particles, the preparation method of the electrolytic copper foil specifically comprises the following steps:

[0048] (1) use the micro-etching solution A to carry out the first micro-etching treatment on the copper foil, and then use the electrolyte to carry out the electrodeposition of the first copper nodule layer to obtain the material A;

[0049] (2) using the micro-etching solution B to carry out the second micro-etching treatment of the material A, and then using the electrolyte to carry out the electrodeposition of the second copper nodule layer to obtain the material B;

[0050] (3) use the micro-etching solution C to carry out the third micro-etching process on the material B, and then use the electrolyte to carry out the third copper-nodularized layer electrodeposition, to obtain the copper-nodularized layer;

[0051] (4) carrying out surface curing treatment, washing with water,...

Embodiment 2

[0059] A high anti-stripping electrolytic copper foil with uniform microscopic surface particles, the preparation method of the electrolytic copper foil specifically comprises the following steps:

[0060] (1) use the micro-etching solution A to carry out the first micro-etching treatment on the copper foil, and then use the electrolyte to carry out the electrodeposition of the first copper nodule layer to obtain the material A;

[0061] (2) using the micro-etching solution B to carry out the second micro-etching treatment of the material A, and then using the electrolyte to carry out the electrodeposition of the second copper nodule layer to obtain the material B;

[0062] (3) use the micro-etching solution C to carry out the third micro-etching process on the material B, and then use the electrolyte to carry out the third copper-nodularized layer electrodeposition, to obtain the copper-nodularized layer;

[0063] (4) carrying out surface curing treatment, washing with water,...

Embodiment 3

[0071] A high anti-stripping electrolytic copper foil with uniform microscopic surface particles, the preparation method of the electrolytic copper foil specifically comprises the following steps:

[0072] (1) use the micro-etching solution A to carry out the first micro-etching treatment on the copper foil, and then use the electrolyte to carry out the electrodeposition of the first copper nodule layer to obtain the material A;

[0073] (2) using the micro-etching solution B to carry out the second micro-etching treatment of the material A, and then using the electrolyte to carry out the electrodeposition of the second copper nodule layer to obtain the material B;

[0074] (3) use the micro-etching solution C to carry out the third micro-etching process on the material B, and then use the electrolyte to carry out the third copper-nodularized layer electrodeposition, to obtain the copper-nodularized layer;

[0075] (4) carrying out surface curing treatment, washing with water,...

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Abstract

The invention provides a high-stripping-resistance electrolytic copper foil with uniform microcosmic surface particles and a preparation method thereof, and relates to the technical field of electrolytic copper foil production, the preparation method of the electrolytic copper foil comprises the following steps: (1) carrying out first micro-etching treatment on a copper foil by using a micro-etching solution A, and then carrying out first copper nodule layer electro-deposition by using an electrolyte to obtain a material A; (2) carrying out secondary micro-etching treatment on the material A by using a micro-etching solution B, and carrying out secondary copper nodule layer electro-deposition by using an electrolyte to obtain a material B; (3) carrying out third micro-etching treatment on the material B by using a micro-etching solution C, and carrying out third copper nodule layer electro-deposition by using an electrolyte to obtain a copper nodule layer; and (4) carrying out surface curing treatment on the copper nodule layer, washing with water, and then carrying out heat-resistant layer treatment, anti-oxidation layer treatment and organic layer treatment to obtain the electrolytic copper foil. The microcosmic plating layer of the electrolytic copper foil is uniformly distributed like particles and has relatively high peel strength.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil production, in particular to a high anti-stripping electrolytic copper foil with uniform microscopic surface particles and a preparation method thereof. Background technique [0002] With the continuous development of electronic products in the direction of miniaturization and multi-function, the development of printed boards in the direction of multi-layer, high integration and high density has been promoted. The line width and spacing of printed circuit patterns are also becoming more and more miniaturized. Therefore, higher requirements are placed on the reliability of circuit boards. For example, thinned copper foils used in fine circuits are required to have higher peel strength and can effectively reduce or avoid the phenomenon of "residual copper" when etching circuits. , These properties of copper foil are closely related to the surface treatment process used by copper fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/10C25D5/34C25D5/48C25D7/06C25D3/38
CPCC25D5/10C25D5/34C25D5/48C25D7/0614C25D3/38Y02E60/10
Inventor 林家宝
Owner 东强(连州)铜箔有限公司
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