Production and processing equipment for metal film

A processing equipment and metal film technology, applied in metal material coating process, vacuum evaporation coating, coating, etc., can solve the problem that metal film production equipment cannot be compatible with vacuum evaporation and magnetron sputtering coating, etc., to prevent Interfering or affecting, enhancing the effect of binding force

Pending Publication Date: 2022-07-12
CHONGQING JIMAT NEW MATERIAL TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to solve the problem that the existing metal film production equipment cannot be compatible with vacuum evaporation and magnetron sputtering coating, the invention provides a metal film production and processing equipment

Method used

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  • Production and processing equipment for metal film

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Embodiment Construction

[0032] In order to better understand the purpose, technical solutions and technical effects of the present invention, the present invention will be further explained below with reference to the accompanying drawings and embodiments. At the same time, it is stated that the embodiments described below are only used to explain the present invention, and are not used to limit the present invention.

[0033] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or an intervening element may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

[0034] The terms "first", "second", "third", "fourth", "fifth" and "sixth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implying Indicates the numb...

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Abstract

The invention relates to production and processing equipment of a metal film, a first evaporation area, a first magnetron sputtering area, a second evaporation area and a second magnetron sputtering area are arranged in a vacuum coating cavity, and partition plates are arranged between the first evaporation area and the first magnetron sputtering area and between the second evaporation area and the second magnetron sputtering area; a thin film penetrates through the area between the first evaporation area and the first magnetron sputtering area and the area between the second evaporation area and the second magnetron sputtering area, penetrates out of the first magnetron sputtering area and then enters the second evaporation area. According to the invention, the partition plates are arranged among different process areas, so that the evaporation process or the magnetron sputtering process is prevented from interfering with another process, the evaporation process and the magnetron sputtering process are compatible, multiple factors such as the thickness of a coating layer, the binding force of the coating layer and the coating cost are integrated, the metal film with high cost performance is obtained, and the production cost is reduced. And meanwhile, the problem that extra cost is generated in the traditional film coating operation process is solved, and the risk that the film is oxidized in the process is also avoided.

Description

technical field [0001] The invention relates to the field of metal film coating, in particular to a metal film production and processing equipment. Background technique [0002] Metal film refers to a metallized film. The specific process is to coat a metal layer on the film surface, so that it has the same electrical conductivity as metal and is lighter than pure metal film. [0003] At present, the main methods of producing metal films are vacuum evaporation and magnetron sputtering. The energy generated by these two processes is different, and the surface properties of the films obtained by depositing metal onto the surface of the film are also slightly different. For example, magnetron The energy required for the sputtering coating process is higher. The energy obtained by the metal atoms after being bombarded by argon ions is high, and the layers are layered on the film and the film is more closely combined with the film, and the bonding force is higher; evaporation is ...

Claims

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Application Information

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IPC IPC(8): C23C14/24C23C14/35C23C14/56
CPCC23C14/24C23C14/35C23C14/562C23C14/568C23C14/56Y02E60/10
Inventor 臧世伟
Owner CHONGQING JIMAT NEW MATERIAL TECH CO LTD
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