Hot melt adhesive as well as preparation method and application thereof
A hot melt adhesive and reaction kettle technology, applied in the field of resin, can solve the problems of large smoke and pungent odor, high power consumption of production equipment, and high production cost, and achieve the effects of improving processing environment, improving environmental protection and reducing melting point.
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Embodiment 1
[0041] The hot melt adhesive of the present invention is composed of the following raw materials in parts by weight: 40 parts of ethylene-vinyl acetate copolymer, 20 parts of vinyl acetate, 7 parts of hydroxyapatite and 25 parts of resin.
[0042] Its preparation method is as follows:
[0043] (1) Pulverize hydroxyapatite, mix with resin,
[0044] (2) adding hydroxyapatite and resin into the reaction kettle, stirring uniformly under the condition of 170-℃;
[0045] (3) in reactor, add ethylene-vinyl acetate copolymer and vinyl acetate;
[0046] (4) the reaction temperature was controlled at 110°C, and the acid was discharged for 20min;
[0047] (5) Lowering the temperature to below 90° C. to obtain the hot melt adhesive.
Embodiment 2
[0049] The hot melt adhesive of the present invention is composed of the following raw materials in parts by weight: 50 parts of ethylene-vinyl acetate copolymer, 30 parts of vinyl acetate, 9 parts of hydroxyapatite and 35 parts of resin.
[0050] Its preparation method is as follows:
[0051] (1) Pulverize hydroxyapatite, mix with resin,
[0052] (2) adding hydroxyapatite and resin into the reaction kettle, stirring uniformly at 180°C;
[0053] (3) in reactor, add ethylene-vinyl acetate copolymer and vinyl acetate;
[0054] (4) the reaction temperature was controlled at 120°C, and the acid was discharged for 30min;
[0055] (5) Lowering the temperature to below 90° C. to obtain the hot melt adhesive.
Embodiment 3
[0057] The hot melt adhesive of the present invention is composed of the following raw materials in parts by weight: 60 parts of ethylene-vinyl acetate copolymer, 40 parts of vinyl acetate, 10 parts of hydroxyapatite and 4050 parts of resin.
[0058] Its preparation method is as follows:
[0059] (1) Pulverize hydroxyapatite, mix with resin,
[0060] (2) adding hydroxyapatite and resin into the reaction kettle, stirring uniformly at 200°C;
[0061] (3) in reactor, add ethylene-vinyl acetate copolymer and vinyl acetate;
[0062] (4) the temperature of reaction is controlled under 130 ℃ of conditions, acid discharge 50min;
[0063] (5) Lowering the temperature to below 90° C. to obtain the hot melt adhesive.
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