Quantum dot light emitting diode and preparation method thereof
A quantum dot light-emitting and diode technology, applied in the field of quantum dots, can solve the problems of low light-emitting efficiency of quantum dot light-emitting diodes, and achieve the effects of reducing material and device degradation, reducing injection barriers, and blocking electron tunneling
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Embodiment 1
[0061]A preparation method of a quantum dot light-emitting diode with a positive bottom emission structure, comprising the following steps:
[0062] Step S1: on the transparent anode substrate, deposit a hole injection layer, the transparent anode is ITO, and the hole injection layer material is WO 3 , the thickness of the transparent anode is 20nm, and the thickness of the hole injection layer is 60nm;
[0063] Step S2: depositing a hole transport layer on the hole injection layer, the material of the hole transport layer is PFB, and the thickness of the hole transport layer is 60 nm;
[0064] Step S3: depositing an interface layer on the hole transport layer, the interface layer material is Li 9 OS 5 Br, the thickness of the interface layer is 100nm;
[0065] Step S4: depositing a quantum dot light-emitting layer on the interface layer, the material of the quantum dot light-emitting layer is PbSe, and the thickness of the quantum dot light-emitting layer is 50 nm;
[006...
Embodiment 2
[0069] A preparation method of a quantum dot light-emitting diode with a positive top emission structure, comprising the following steps:
[0070] Step S1: on the transparent anode substrate, deposit a hole injection layer, the transparent anode is FTO, and the hole injection layer material is WO 3 , the thickness of the transparent anode is 20nm, and the thickness of the hole injection layer is 60nm;
[0071] Step S2: depositing a hole transport layer on the hole injection layer, the material of the hole transport layer is TCTA, and the thickness of the hole transport layer is 60 nm;
[0072] Step S3: depositing an interface layer on the hole transport layer, the interface layer material is Li 9 OS 5 Br, the thickness of the interface layer is 100nm;
[0073] Step S4: depositing a quantum dot light-emitting layer on the interface layer, the material of the quantum dot light-emitting layer is InP, and the thickness of the quantum dot light-emitting layer is 50 nm;
[0074]...
Embodiment 3
[0077] A preparation method of a quantum dot light-emitting diode with an inverted bottom emission structure, comprising the following steps:
[0078] Step S1: depositing an Ag layer on the substrate by means of evaporation, and the thickness of the Ag layer is 5 nm;
[0079] Step S2: depositing an electron transport layer on the Ag layer, the material of the electron transport layer is SnO, and the thickness of the electron transport layer is 50 nm;
[0080] Step S3: depositing a quantum dot light-emitting layer on the electron transport layer, the material of the quantum dot light-emitting layer is CdSe, and the thickness of the quantum dot light-emitting layer is 50 nm;
[0081] Step S4: depositing an interface layer on the quantum dot light-emitting layer, the material of the interface layer is Li 9 OS 5 Br, the thickness of the interface layer is 80nm;
[0082] Step S5: depositing a hole transport layer on the interface layer, the material of the hole transport layer i...
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