Monocrystalline silicon wafer texturing equipment

Abstract

The invention provides monocrystalline silicon wafer texturing equipment which comprises a workbench, the workbench is provided with a feeding device used for supplying crystal silicon wafers, a liquid supply device used for supplying texturing crystal silicon wafers and a reaction device used for texturing reaction, after the feeding device conveys the crystal silicon wafers to the reaction device, the liquid supply device conveys texturing liquid to the reaction device, and the reaction device is used for texturing reaction. After silicon wafer texturing is completed, the reaction device pours out the silicon wafer and the texturing liquid for next use, the texturing equipment can enable the silicon wafer to obtain the texturing liquid with the same concentration and the same height every time, the reaction time is consistent, and the texturing efficiency is improved. The problem that the reflectivity of the crystal silicon wafers is different due to the difference of the etching degrees of the crystal silicon wafers is solved, and it is guaranteed that all the crystal silicon wafers can obtain the consistent texturing effect.

Description

technical field [0001] The invention relates to the field of silicon wafer texturing equipment, and more particularly, to a single crystal silicon wafer texturing equipment. Background technique [0002] The main production processes of crystalline silicon solar cells are usually: texturing, diffusion, wet etching, PECVD deposition, screen printing and sintering. Texturing is the first process of solar cell production, and its main purposes are: [0003] 1. Remove the mechanical damage layer on the surface of the silicon wafer; [0004] 2. Remove oil and metal impurities on the surface of silicon wafers; [0005] 3. Form an undulating suede surface, increase the light-absorbing area, reduce the reflectivity of light, increase the short-circuit current (Isc), and finally improve the photoelectric conversion efficiency of the battery. [0006] Texturing is mainly processed by HNO3, HF texturing, washing, KOH corrosion, washing, HF, HCl cleaning, etc. The texturing equipment ...

AI Technical Summary

Problems solved by technology

[0008] In order to overcome the fact that the dope concentration in the texturing tank decreases gradually with the continuous etching of the crystalline silicon wafer, the concentration of the dope needs to be continuously replenished, but the replenishment of the dope concentration cannot make the overall concentration of the texturing tank consistent in time. There is also a certain difference in the degree of corrosion, which leads to the problem that there is also a difference in the reflectivity of the crystalline silicon wafer. A texturing equipment for monocrystalline silicon wafers is provided.

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