Vacuum packaging system for integrated circuit board

Abstract

The invention relates to an integrated circuit board vacuum packaging system which comprises a cabinet body and a cover body which are connected in a sealed mode, and a translation mechanism is arranged between the cabinet body and the cover body. A vacuum unit and an electric control part are arranged in the cabinet body; the translation mechanism comprises a driving mechanism, a longitudinal movement mechanism and a transverse movement mechanism which are adjacently and slidably connected; the longitudinal moving mechanism comprises a longitudinal moving plate, a longitudinal moving synchronous wheel set, an upper sliding block and a lower sliding block; the transverse moving mechanism comprises a transverse moving rod, a lower sliding rail, a transverse moving synchronous wheel, a spiral pipe, a fixing plate, a glue injection needle and a synchronous belt; the driving mechanism comprises a foundation rod, an upper sliding rail, a driving synchronizing wheel and a driving motor. According to the vacuum packaging system for the integrated circuit board, vacuum plastic packaging and curing are achieved, the yield is increased, and the curing time is shortened.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to a vacuum packaging system for an integrated circuit board. Background technique [0002] An integrated circuit is a miniature electronic device or component. Using semiconductor manufacturing processes such as oxidation, lithography, diffusion, epitaxy, and aluminum evaporation, components and wirings such as transistors, resistors, capacitors, and inductors required in a circuit are interconnected and fabricated on a small or several small semiconductor wafers. or dielectric substrate, and then solder the electronic device packaged in a package. [0003] The integrated circuit package not only plays the role of electrical connection between the bonding point in the integrated circuit chip and the outside, but also provides a stable and reliable working environment for the integrated circuit chip, and plays a role in mechanical or environmental protection for the integrated ci...

AI Technical Summary

Problems solved by technology

[0006] 1. In the plastic sealing process, it is easy to mix air bubbles, resulting in defective products in the packaging process;

[0007] 2. In the curing process, the curing time is long, which reduces the overall efficiency

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