PCBA needle bed testing machine and testing method
A testing machine and needle bed technology, applied in the field of semiconductor testing equipment, can solve the problems that the processing cycle cannot meet the needs of production, increase processing costs, and high density of test points, reduce the number of test points and processing difficulty, improve the safety factor, The effect of improving economic efficiency
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[0021] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. The embodiments of the present invention, and all other embodiments obtained by those of ordinary skill in the art without creative work, fall within the protection scope of the present invention.
[0022] The general test device can only move in one dimension. For the card under test with relatively dense test points, it increases the difficulty of positioning and processing the thimble of the test device, which is likely to cause a defective rate and increase the processing cost.
[0023] For a specific card under test, its area is limited, and test points cannot be added unlimitedly.
[0024] In the actual test, when the thimbles are too dense...
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