Unsealing device and unsealing method for flip chip device

Abstract

The invention belongs to the technical field of semiconductors, and particularly relates to an unsealing device and unsealing method for a flip chip device.The unsealing device comprises a base, a polishing box and a cleaning box are arranged at the top of the base, a plurality of supporting legs are fixedly connected to the bottom of the polishing box and the bottom of the cleaning box, a supporting plate is arranged in the polishing box, and the supporting legs are fixedly connected to the bottom of the cleaning box. An adjusting device is arranged at the bottom of the supporting plate, a grinding device is arranged at the top of the supporting plate, and clamping plates are arranged on the two sides of the supporting plate. The polishing device is arranged, in the process of polishing the base plate, a first electric polishing roller and a second electric polishing roller are driven by a third screw to polish the base plate from two opposite directions at the same time, and due to the fact that the rotating directions of the first electric polishing roller and the second electric polishing roller are opposite, the polishing effect is good; therefore, friction force generated by the first electric grinding roller and the second electric grinding roller on the base plate can be counteracted, and it is guaranteed that the base plate cannot slide in the grinding process.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to an unsealing device and an unsealing method for flip-chip devices. Background technique [0002] A flip chip is a leadless structure that typically contains circuit elements. Flip-chip is to deposit tin-lead balls on the I / O pad, and then flip the chip to heat and use the molten tin-lead balls to combine with the ceramic substrate. This technology replaces conventional wire bonding and gradually becomes the mainstream of packaging in the future. It is currently mainly used in high-time packaging. Mainly CPU, GPU and Chipset products. In order to detect the product quality of the flip chip, it is necessary to unseal the flip chip. The existing unsealing method is to use a grinding device to polish the substrate on the flip chip, and then use hydrofluoric acid to bond the substrate and the chip. The glue used is removed so that the chip can be completely separa...

AI Technical Summary

Problems solved by technology

[0003] When grinding the substrate, the chip will be placed on the grinding table first, and then the substrate will be polished with a grinder, but the existing grinding method is generally Gradually grind the substrate along one direction. This method makes the chip slide due to the friction of the grinder when grinding the chip, which affects the grinding efficiency. In addition, during the grinding process, the grinding depth of the grinder will decrease. Changes due to the movement of the chip, resulting in uneven grinding of the substrate by the grinding device, and careless operation will cause damage to the chip

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