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Method for preparing ultra-light Fresnel lens

A Fresnel lens, ultra-lightweight technology, used in lenses, instruments, optics, etc., can solve the problems of weak reticle versatility, small processing aperture, large overlay error, etc., to increase the machinability and processing. The effect of contour accuracy, reduction of overlay errors, reduction of time spent

Pending Publication Date: 2022-06-07
INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The technical problem to be solved by the present invention is to overcome the problems of large overlay error, weak reticle versatility, small processing aperture and high cost in the traditional method, and realize low-cost and high-efficiency manufacturing and processing of ultra-lightweight Fresnel lenses. The invention provides a method for preparing ultra-light Fresnel lens

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  • Method for preparing ultra-light Fresnel lens

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Embodiment Construction

[0020] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0021] The present invention is a method for preparing an ultra-lightweight Fresnel lens, which includes three steps: the fabrication of an ultra-lightweight optical film and a rigid substrate composite, the contour processing of the ultra-lightweight Fresnel lens, and the ultra-lightweight Fresnel lens Stripping. Specifically, it includes rigid substrate 1, optical film material precursor solution coating 2, optical film material precursor solution curing 3, ultra-light optical film and rigid substrate composite 4, ultra-lightweight Fresnel lens contour processing 5, ultra-light Quality Fresnel lens 6. The workflow is to first process a rigid substrate with a smooth plane 1, then coat the surface of the rigid substrate with the optical film material precursor solution 2, and then cure the optical film material precursor solution 3 to form an ul...

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Abstract

The invention relates to a method for preparing an ultra-light Fresnel lens. The method comprises the steps of manufacturing an ultra-light optical thin film and rigid substrate complex, machining the contour of the ultra-light Fresnel lens and demolding the ultra-light Fresnel lens. The working process comprises the following steps: firstly, processing a rigid substrate with a smooth plane, then coating the surface of the rigid substrate with an optical thin film material precursor solution, and then curing the optical thin film material precursor solution to form an ultra-light optical thin film and rigid substrate complex. Then processing the outline of the Fresnel lens on the surface of the complex, and finally separating the optical thin film with the outline of the Fresnel lens on the surface from the rigid substrate through stripping of the ultra-light Fresnel lens to obtain the ultra-light Fresnel lens. The method is particularly suitable for preparing the ultra-light Fresnel lens with an optical thin film material as a substrate, and is an ultra-light Fresnel lens preparation method which is efficient, low in process cost, high in flexibility and wide in aperture range.

Description

technical field [0001] The invention belongs to the field of optical element processing and manufacturing, and particularly relates to a method for preparing an ultra-light Fresnel lens. Background technique [0002] In the preparation method of ultra-light Fresnel lens, it is generally processed by the method of multiple pattern transfer, overetching, or grayscale photolithography from a binary mask. The method of multiple transfer printing and overlay engraving is complicated, the overlay error is large, and it is difficult to process a Fresnel lens with a continuous relief profile structure, while grayscale lithography has low processing flexibility and small processing aperture due to its inherent characteristics of the process. , The production cost is high, and the universality of the mask is weak. SUMMARY OF THE INVENTION [0003] The technical problems to be solved by the present invention are as follows: overcome the problems of large overlay error, weak mask uni...

Claims

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Application Information

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IPC IPC(8): G02B3/00G02B3/08
CPCG02B3/0012G02B3/0018G02B3/0031G02B3/08Y02E10/52
Inventor 范斌吴湘辛强焦培琦邵俊铭罗倩高国涵毛丹波
Owner INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI
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