Wafer color detection equipment

Abstract

The invention discloses wafer color detection equipment which comprises a feeding module, a detection module and a discharging module which are sequentially arranged at the top of the detection equipment, and the feeding module comprises a feeding conveying mechanism, a supplementing conveying mechanism and a feeding grabbing mechanism; a feeding buffering mechanism is arranged on the feeding conveying mechanism, and a buffering pushing mechanism can push the wafer box on the feeding pushing chain into a buffering cavity for buffering; the detection module comprises a detection support frame and at least one visual detection mechanism arranged on one side of the detection support frame, the visual detection mechanism can perform photographing detection on the wafer, the detection module further comprises a marking mechanism, and when the visual detection mechanism detects wafer defects, the marking mechanism performs marking on the surface of the wafer; therefore, the wafers can be classified conveniently. A box body conveying chain is arranged on one side of the discharging conveying mechanism, a plurality of storage boxes are arranged on the box body conveying chain, and the wafer boxes are pushed into the storage boxes through the pushing mechanical arm.

Description

Technical field [0001] The invention involves the field of chip color testing, and more specific, it involves a chip color detection equipment. Background technique [0002] With the advancement of science and technology, more and more electronic products have come out, and it has gradually become a trend of development and development of miniaturization. The miniaturization of electronic products is mainly due to the large number of chips, diode, transistor, or light -emitting diode made of semiconductor materials made of semiconductor materials, which can greatly reduce the volume of the overall circuit, and then save the setting space. To achieve a miniaturization. [0003] It is well known that when the semiconductor electronic material is made, it is mainly due to the completion of the chip production. Whether the grains in the procuratorial chip are in line with the factory or setting. , To facilitate subsequent packaging operations. [0004] The traditional chip color dete...

AI Technical Summary

Problems solved by technology

[0004] The traditional wafer color inspection equipment takes pictures of the wafers, and cannot automatically classify the wafers as qualified products. In addition, during the loading and unloading process of the wafers, the wafers cannot be cached, and manual loading or unloading is required. Unloading, wasting manpower and material resources

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