Manufacturing method of high-thermal-conductivity copper-clad ceramic substrate

Abstract

The invention discloses a manufacturing method of a high-thermal-conductivity copper-clad ceramic substrate, and aims to provide the manufacturing method of the high-thermal-conductivity copper-clad ceramic substrate which is simple in manufacturing process, capable of reducing the manufacturing cost, firm in structural connection of the high-thermal-conductivity copper-clad ceramic substrate and free of the environmental protection problem of electroplating. The method sequentially comprises the following steps of: 1, carrying out punch forming on a substrate copper sheet and a substrate soldering lug; secondly, a substrate copper sheet and a substrate soldering lug are positioned on a substrate welding tool, the substrate welding tool comprises a bottom plate, an upper pressing plate, a ceramic plate limiting groove and a plurality of copper sheet limiting grooves, the ceramic plate limiting groove and the copper sheet limiting grooves are formed in the bottom plate, the substrate copper sheet is positioned in the copper sheet limiting grooves, and the substrate soldering lug is placed on the upper surface of the substrate copper sheet; thirdly, the solder resist preassembling groove is coated with solder resist; fourthly, the ceramic plate is placed in the ceramic plate limiting groove; fifthly, the ceramic plate limited in the ceramic plate limiting groove is pressed through an upper pressing plate; and sixthly, the base plate welding tool is placed in a vacuum brazing furnace for welding.

Description

Technical field [0001] The invention involves a method of making a ceramic substrate, which specifically involves a method of making a high -warming copper ceramic substrate. Background technique [0002] The existing high -guide thermal covering copper ceramic substrate production method is generally used to place a layer of metal membrane on the ceramic plate (taking copper as an example). At present, the production methods of this high -guide thermal covering copper ceramic substrate are mainly in shortcomings. First, the connection between copper and non -metallic (ceramic plate) is not reliable, and the performance of tensile or shear force is poor. Second, the surface coating technology Nowadays, there are electroplating and environmental protection problems. Invention content [0003] The purpose of the present invention is to provide a high -guide thermal covering copper ceramic substrate production method with high -guide and environmental protection issues that not onl...

AI Technical Summary

Problems solved by technology

The current production method of this high thermal conductivity copper-clad ceramic substrate mainly has the following shortcomings. First, the connection between copper and non-metal (ceramic plate) is not reliable, and the performance of tensile or shear force is poor; Second, the surface coating process Nowadays, most of them are electroplating, which has environmental protection problems; third, laser marking is required after electroplating on the ceramic surface, and the cost is high

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