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Composite metal foil and circuit board

A composite metal and circuit board technology, applied in circuit devices, printed circuit components, circuit electrostatic discharge protection, etc., to prevent resistance function failure, meet ESD resistance, and meet the effect of precision

Pending Publication Date: 2022-05-27
GUANGZHOU FANGBANG ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

With the precision, miniaturization and thinning of electronic products, integrating many embedded resistors in the small internal space of electronic products may bring new risks

Method used

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  • Composite metal foil and circuit board
  • Composite metal foil and circuit board
  • Composite metal foil and circuit board

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Embodiment Construction

[0037] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved more clearly, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings. Obviously, the described embodiments are only the present invention. Some examples, but not all examples. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present invention.

[0038] In the description of the present invention, unless otherwise expressly specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection...

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Abstract

The invention discloses a composite metal foil and a circuit board, the composite metal foil comprises a first conductive layer and a first resistive layer, the first resistive layer is arranged on one side of the first conductive layer, the thickness range of the first resistive layer is 20-1500nm, and the range of the sheet resistance of the first resistive layer is 3-300ohm. By limiting the thickness range of the first resistive layer to be 20-1500 nm and the sheet resistance range of the first resistive layer to be 3-300 ohm, the first resistive layer not only can ensure the resistance performance of the first resistive layer in use, but also can meet the ESD (Electro-Static Discharge) resistance performance, that is, after the resistor is impacted by an electrostatic high voltage, the resistor cannot be broken down by the electrostatic high voltage, and the service life of the resistor is prolonged. Therefore, the resistor function failure of the embedded resistor is effectively prevented, and the service life of the embedded resistor is effectively ensured.

Description

technical field [0001] The invention relates to the technical field of composite metal foils, in particular to a composite metal foil and a circuit board. Background technique [0002] With the rapid development of wireless communication and electronic equipment, the electronic equipment is evolving towards precision, miniaturization and thinning. Therefore, the size of the components inside the electronic equipment is required to be miniaturized and thinned as much as possible. [0003] The resistive elements inside electronic equipment have gradually developed into thin and light from the previous plug-in resistors with pins, to chip resistors, and then to embedded resistors. The preparation process of the embedded resistor is roughly as follows: the composite metal foil is attached to the circuit board, and the embedded resistor is etched through an etching process. With the precision, miniaturization, and thinning of electronic products, the integration of numerous embe...

Claims

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Application Information

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IPC IPC(8): H05K1/16H05K1/02
CPCH05K1/167H05K1/0259Y02E60/10
Inventor 苏陟
Owner GUANGZHOU FANGBANG ELECTRONICS
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