A tool adjusting structure and dicing machine

Abstract

The invention provides a cutter adjustment structure and a dicing machine, belonging to the technical field of mechanical transmission. The cutter adjustment structure comprises: a mounting seat, which is fixedly connected with the dicing machine body; a driving member, the driving end is connected with the rotating shaft; the driving member drives the rotating shaft to rotate, changing the abutment force applied when the scriber is in contact with the wafer; the present invention passes the scriber support through the rotating shaft It is installed on the mounting seat, so the scribing knife can rotate around the rotating shaft, and the rotating shaft is driven to rotate by the driving element, and the driving element indirectly drives the scribing knife to rotate around the rotating shaft. On the one hand, the rotation of the scribing knife can change the contact between the scribing knife and the wafer. On the other hand, the force applied by the scribe to the wafer in the direction of the axis of the scribe can be changed, so as to adjust the abutment force applied when the scribe and the wafer are in contact, so as to achieve accurate wafer cutting process. The advantage of adjusting the size of the cutting force.

Description

technical field [0001] The invention relates to the technical field of mechanical transmission, in particular to a tool adjusting structure and a dicing machine. Background technique [0002] It is mainly aimed at optical communication chips made of gallium arsenide and indium phosphide. The wafer needs to be cut before use. The traditional wafer cutting technology is manually cut with a diamond knife. The consumables are large and the strength cannot be determined. The width of the wafer chips is relatively large, uneven, and has poor applicability and low efficiency. [0003] In the prior art, the spring pressure method is used, but the accuracy will be wrong, and the service life of the spring is short, so providing a device that can accurately adjust the cutting force during the wafer cutting process has become the main problem of current wafer cutting. SUMMARY OF THE INVENTION [0004] Therefore, the technical problem to be solved by the present invention is to overc...

AI Technical Summary

Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defect that the cutting force cannot be precisely adjusted in the prior art, so as to provide a cutter adjustment structure: including

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