Cutter adjusting structure and scribing machine

Abstract

The invention provides a cutter adjusting structure and a scribing machine, and belongs to the technical field of mechanical transmission, and the cutter adjusting structure comprises a mounting seat which is fixedly connected with a scribing machine body; the scratching knife bracket is rotationally mounted on the mounting seat through a rotating shaft; the driving end of the driving piece is connected with the rotating shaft; the driving piece drives the rotating shaft to rotate, and the abutting force applied when the scratching knife makes contact with the wafer is changed; according to the invention, the scratching knife support is installed on the installation seat through the rotating shaft, so that the scratching knife can rotate around the rotating shaft, the driving member drives the rotating shaft to rotate, the driving member indirectly drives the scratching knife to rotate around the rotating shaft, and the rotation of the scratching knife can change the abutting depth of the scratching knife and the wafer; on the other hand, the force applied to the wafer by the scratching knife in the axis direction of the scratching knife can be changed, then the abutting force applied when the scratching knife makes contact with the wafer can be adjusted, and therefore the advantage that the cutting force is accurately adjusted in the wafer cutting process is achieved.

Description

technical field [0001] The invention relates to the technical field of mechanical transmission, in particular to a tool adjusting structure and a dicing machine. Background technique [0002] It is mainly aimed at optical communication chips made of gallium arsenide and indium phosphide. The wafer needs to be cut before use. The traditional wafer cutting technology is manually cut with a diamond knife. The consumables are large and the strength cannot be determined. The width of the wafer chips is relatively large, uneven, and has poor applicability and low efficiency. [0003] In the prior art, the spring pressure method is used, but the accuracy may be wrong, and the service life of the spring is short, so providing a device that can precisely adjust the cutting force during the wafer cutting process has become the main problem of current wafer cutting. SUMMARY OF THE INVENTION [0004] Therefore, the technical problem to be solved by the present invention is to overcom...

AI Technical Summary

Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defect that the cutting force cannot be precisely adjusted in the prior art, so as to provide a cutter adjustment structure: including

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