Thin film capacitor element with middle heat dissipation through hole structure

Abstract

The invention relates to a thin-film capacitor element with a middle heat dissipation through hole structure, which comprises a capacitor element core and a shell for accommodating the capacitor element core, a central through hole is formed in the shell, and a core rod through hole in the capacitor element core is communicated with the central through hole, so that part of heat generated when the capacitor element core works is diffused out through the central through hole. The capacitor element with the radial middle through hole has good natural ventilation and heat dissipation capability, so that the working temperature rise of the capacitor element is obviously reduced, the possibility of thermal stress and thermal damage is greatly reduced, the service life of the capacitor element is prolonged, and the cost of enterprises and society is reduced under lower enterprise cost and social cost. Enterprises and society are benefited at the same time through improvement of product quality and service life.

Description

technical field [0001] The invention relates to the technical field of thin film capacitors, in particular to a thin film capacitor element with an intermediate heat dissipation through-hole structure. Background technique [0002] Definition of terms: In this field, the capacitor core refers to the non-metallic film that is usually rolled around the mandrel stack with the metal coating as the pole plate, including the lead-out wire of the pole plate, without sealing measures, exposed to the air, The structure of a single basic capacitive element that is easily damaged by power-on work cannot be used directly; the capacitive element is a combination of a single capacitive element structure that includes a capacitive element core and has sealing measures to isolate the air, and can work independently and reliably; the capacitive element shell specifically refers to the The shell that accommodates the above-mentioned capacitor element generally includes capacitive element pack...

AI Technical Summary

Problems solved by technology

[0003] So far, if the film capacitor core is packaged in a separate element shell, the shell is solid and fully sealed; and due to the poor thermal conductivity of the film, the high-temperature area of ​​the capacitor element is in the core part, and the thermal stress and thermal stress of the capacitor element The damage all comes from this; high temperature operation is one of the main reasons for the damage of the capacitor element, and even a large area of ​​short circuit between the internal plates of the element is caused by overheating operation, and the film is ignited by the short circuit arc, which causes the element to burn, explode and other vicious accidents

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