Test connection device for mass production test of fA-level current

Abstract

The invention discloses a test connecting device for mass production test of fA-level current, which is characterized by comprising a test golden finger and an electromagnetic shielding body wrapping and surrounding the test golden finger, and the test golden finger is electrically connected with a device end pin of a chip to be tested and a current measuring device respectively. The electromagnetic shielding body comprises a first insulating ring, a shielding inner ring, a second insulating ring, a voltage rapid stabilization shielding ring, a third insulating ring and a grounding shielding ring which are sequentially arranged from inside to outside, the electromagnetic shielding body is electrically connected with a shielding control circuit, and the shielding control circuit firstly controls the potential of the voltage rapid stabilization shielding ring to be the same as the potential of the test golden finger; controlling the potential of the shielding inner ring to be the same as the potential of the test golden finger until the measurement is finished; the test connecting device has the advantages that the influence of the external environment on the test golden finger can be reduced or avoided, and the measurement precision is improved; and the measurement time of the fA-level leakage current by the current measurement device is shortened, and the measurement efficiency is improved.

Description

technical field [0001] The invention relates to a test connection device for current, in particular to a test connection device for mass production testing fA level current. Background technique [0002] At present, according to the requirements of working application scenarios, etc., only a very small leakage current is allowed to exist on the device terminals of chips such as operational amplifiers during operation, and the leakage current is generally fA level. For the leakage current of fA level, it is usually measured by technical means in the experimental environment at present, but in the actual mass production test, due to the extremely weak leakage current and the long distance between the chip under test and the current measurement device, the environment The impact causes the measurement accuracy of the leakage current of the chip to be tested to be deteriorated by the current measurement device, thereby making it impossible to effectively detect the leakage curre...

AI Technical Summary

Problems solved by technology

For the leakage current of fA level, it is usually measured by technical means in the experimental environment at present, but in the actual mass production test, due to the extremely weak leakage current and the long distance between the chip under test and the current measurement device, the environment The influence leads to the deterioration of the measurement accuracy of the leakage current of the chip under test by the current measurement device, resulting in the inability to effectively detect the leakage current, and it is difficult to meet the requirements of mass production testing

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