Monolithic wafer cleaning device and overall cleanliness control method thereof

A control method, a single-chip technology, applied in cleaning methods and utensils, cleaning methods using gas flow, chemical instruments and methods, etc., can solve the problem of reducing yield, wafer etching, difficult to control wafer cleanliness, etc. question

Pending Publication Date: 2022-04-29
江苏启微半导体设备有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] At present, single-wafer cleaning is a common wafer cleaning method, using liquid medicine and deionized water as cleaning materials, but it is difficult to control the cleanliness of the wafer during the single-wafer cleaning process, and the residue of the liquid medicine will Wafer etching, thereby reducing yield

Method used

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  • Monolithic wafer cleaning device and overall cleanliness control method thereof
  • Monolithic wafer cleaning device and overall cleanliness control method thereof

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Embodiment 1

[0039] Such as figure 1 As shown, the present embodiment provides a method for controlling the overall cleanliness in the single-chip wafer cleaning process, including: in the cleaning process of the wafer, providing a rotating jet to the wafer platform through the gas jet pipeline. flow of pure carbon dioxide gas, and provide pure supercritical carbon dioxide fluid to the wafer platform through the fluid jet pipeline, and then convert the pure supercritical carbon dioxide fluid into a gaseous state through the fluid vaporization component, and then send it to the wafer platform through the gas discharge pipeline The wafer platform provides negative pressure pumping; where,

[0040] The process in which the gas jet pipeline provides the swirling jet flow of pure carbon dioxide gas to the wafer platform includes:

[0041] providing rotating jets of pure carbon dioxide gas to the wafer platform in the form of pressurization, decompression, and pressurization cycles; or / and

[...

Embodiment 2

[0045] Such as figure 2 As shown, this embodiment provides a single-chip wafer cleaning device based on the control method described in Embodiment 1, including:

[0046] wafer platform 1;

[0047] The platform lifting assembly 4 is arranged at the bottom of the wafer platform 1, and is used to control the distance between the pure carbon dioxide gas and the wafer platform 1 during the rotating jet flow;

[0048] The gas jet flow pipeline 2 is used to provide the pure carbon dioxide gas of the rotating jet flow to the wafer platform 1;

[0049] A pressure regulating assembly 3, located at the outlet of the gas jet pipeline 2, is used to control the pressure of the pure carbon dioxide gas rotating jet;

[0050] The temperature adjustment assembly 5 is located at the outlet of the gas jet pipeline 2, and is used to control the temperature of the pure carbon dioxide gas during the rotating jet flow;

[0051] A fluid jet pipeline 7 is used to provide pure supercritical carbon d...

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Abstract

The invention relates to a method for controlling the overall cleanliness in a single-chip wafer cleaning process. A process of providing rotary jet flow pure gas for a wafer platform by a gas jet flow pipeline comprises the following steps of: providing the rotary jet flow pure gas for the wafer platform in a pressurization, decompression and pressurization circulation mode; or / and providing pure gas of rotary jet flow for the wafer platform in a close, far and close circulation mode; or / and providing pure gas of rotary jet flow for the wafer platform in a hot air, cold air and hot air circulation mode. According to the control method for the overall cleanliness in the single-chip wafer cleaning process, the surface of the wafer and the wafer platform can be integrally cleaned in at least one mode of pressurization, decompression, pressurization circulation, approaching, leaving, approaching circulation or hot air circulation, cold air circulation and hot air circulation; therefore, the overall cleanliness in the cleaning process of the monolithic wafer is controlled; the supercritical liquid carbon dioxide fluid can further dissolve residual organic matters.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a single-chip wafer cleaning device and a method for controlling the overall cleanliness thereof. Background technique [0002] At present, single-wafer cleaning is a common wafer cleaning method, using liquid medicine and deionized water as cleaning materials, but it is difficult to control the cleanliness of the wafer during the single-wafer cleaning process, and the residue of the liquid medicine will Wafer etching, thereby reducing the yield rate. Contents of the invention [0003] The object of the present invention is to provide a single-chip wafer cleaning device and a method for controlling its overall cleanliness to address the deficiencies in the prior art. [0004] For realizing above-mentioned object, the technical scheme that the present invention takes is: [0005] The first aspect of the present invention is to provide a method for controlli...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/67B08B5/02
CPCH01L21/67253H01L21/02057H01L21/02101B08B5/02
Inventor 陈丁堃邓信甫丁立
Owner 江苏启微半导体设备有限公司
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