Metal powder for forming circuit on surface of three-dimensional non-metal base material by spraying

A technology of substrate surface and metal powder, applied in the field of metal powder, can solve the problems of increasing environmental burden, waste of resources, etc., and achieve the effects of excellent anti-rust effect, less waste of raw materials, and high spraying precision

Pending Publication Date: 2022-04-26
吉安市瑞鸿电子有限公司
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the production process, discarded circuit boards are often discarded as garbage, which not only causes waste of resources but also increases the burden on the environment.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The invention proposes a metal powder that forms a circuit by spraying on the surface of a three-dimensional non-metallic substrate. The raw materials for the preparation of the metal powder include 300-400 parts of metal extract from waste circuit boards, 23 parts of coupling agent, and antioxidant 10-20 parts and 5-15 parts of curing agent; the metal powder is 400 mesh, the metal purity is above 95%, and the circuit resistivity is 1.5×10 2 Ω·cm 2 / m-2.5×10 2 Ω·cm 2 / m.

Embodiment 2

[0023] The invention proposes a metal powder that forms a circuit by spraying on the surface of a three-dimensional non-metallic substrate. The raw materials for the preparation of the metal powder include 300 parts of waste circuit board metal extract, 2 parts of coupling agent, and 10 parts of antioxidant And curing agent 5 parts.

[0024] Further, the coupling agent is a mixture of titanate coupling agent CT136 and JSC, which can effectively disperse metal powder and facilitate the formation of a conductive network.

[0025] Further, the curing agent is an aromatic amine curing agent, and since the nitrogen element of the amino group can form a hydrogen bond with the metal, it has an excellent antirust effect.

[0026] Further, the antioxidant is SiO 2 ; SiO 2 After the circuit is formed, a protective film is formed on the outside of the metal powder to prevent oxidation.

[0027] Further, the extraction method of metal extracts from waste circuit boards is as follows: f...

Embodiment 3

[0034] The invention proposes a metal powder that forms a circuit by spraying on the surface of a three-dimensional non-metallic substrate. The raw materials for the preparation of the metal powder include 400 parts of waste circuit board metal extract, 3 parts of coupling agent, and 20 parts of antioxidant And curing agent 15 parts.

[0035] Further, the coupling agent is a mixture of titanate coupling agent CT136 and JSC, which can effectively disperse metal powder and facilitate the formation of a conductive network.

[0036] Further, the curing agent is an aromatic amine curing agent, and since the nitrogen element of the amino group can form a hydrogen bond with the metal, it has an excellent antirust effect.

[0037] Further, the antioxidant is SiO 2 ; SiO 2 After the circuit is formed, a protective film is formed on the outside of the metal powder to prevent oxidation.

[0038] Further, the extraction method of metal extracts from waste circuit boards is as follows: ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to the technical field of circuit processing, in particular to metal powder for forming a circuit on the surface of a three-dimensional non-metal base material through spraying. According to the invention, the metal extract of the waste circuit board is used as a main raw material, the most metal in the extract is copper, and in addition, gold, aluminum, nickel, lead and silicon metals are contained, so that the conductivity, the ductility and the wear resistance are good, and the recycling of waste resources is realized. In addition, the coupling agent is added, metal powder can be effectively dispersed, and a conductive network can be formed easily. And the curing agent has an excellent antirust effect. And the antioxidant forms a protective film outside the metal powder after the circuit is formed, so that an anti-oxidation effect is achieved. The performance of the metal powder is adjusted and improved, and the formed circuit is low in cost and good in performance. And in cooperation with 3D printing, laser engraving and high-pressure spraying technologies, the metal powder is firmly attached to the surface of the three-dimensional non-metal base material, the spraying operation is simple and easy to implement, the spraying precision is high, and waste of raw materials is little.

Description

technical field [0001] The invention relates to the technical field of circuit processing, in particular to a metal powder for forming a circuit by spraying on the surface of a three-dimensional non-metal substrate. Background technique [0002] The industry needs to use ordinary plastics as bearing shells, even on the surface of three-dimensional non-metallic substrates, to manufacture circuits, but the electrical properties and mechanical adhesion of ordinary shells are poor in electroless plating circuits, and traditional plastics are used in the electroless plating process. Electroless plating process has greater pollution. [0003] In addition, in addition to 30% inert oxide and 30% plastic, the circuit board also contains 40% metal, and there is 0.1% gold in the metal content. In the production process, discarded circuit boards are often discarded as garbage, which not only wastes resources but also increases environmental burdens. Contents of the invention [0004...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/10B22F5/00B22F10/00B33Y10/00B33Y70/10
CPCB22F10/00B22F5/00B33Y70/10B33Y10/00
Inventor 罗彩云罗灿烂
Owner 吉安市瑞鸿电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap