Packaging process of power electronic transformer based on 3D photocuring printing

Abstract

The invention provides a packaging process of a power electronic transformer based on 3D photocuring printing, and relates to the technical field of transformer packaging. The process comprises the following steps: printing a skeleton network, pouring, applying voltage, applying ultrasonic waves, electrifying, thermally curing and polishing. An epoxy resin printing framework network is adopted to position and fix an iron core and a winding at the first stage of packaging, the winding is effectively prevented from loosening or deforming in the packaging process, epoxy resin containing filler is adopted as a pouring body, the thermal resistance and the expansion coefficient can be remarkably reduced, the heat dissipation performance is improved, and the cracking risk is reduced; the epoxy resin is easy to electrowet a solid in a high-voltage electric field; ultrasonic waves have the characteristic of improving the infiltration capacity, and the infiltration effect of filler-containing resin and a framework network is further improved; the winding is electrified, so that the winding is firstly heated, the casting body is solidified from inside to outside, and external resin is allowed to perform automatic feeding on the shrinkage cavity, so that the internal defects of packaging are remarkably reduced, and the reliability of packaging is improved.

Description

technical field [0001] The invention relates to the technical field of transformer packaging, in particular to a packaging process for power electronic transformers based on 3D photo-curing printing. Background technique [0002] In recent years, the application of power electronics technology in power systems has become more and more extensive and in-depth. The insulation design of high-frequency transformers affects the overall safety, applicability and power density of the transformer, especially for large-capacity high-frequency transformers, which have high voltage levels and put forward higher requirements for insulation design. The stability of the lower insulation has become a research problem. The packaging technology of the module is an important part of the integration of power electronic systems, which may directly affect its electrical performance and thermal performance, so it is of great significance and value to study its packaging method. [0003] With the...

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the existing technology, the present invention provides a packaging process for power electronic transformers based on 3D photo-curing printing, which solves the problems of easy cracking and difficult heat dissipation of transformer packages