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Composite particle for improving performance of copper-clad plate

A technology of composite particles and copper-clad laminates, applied in the field of composite materials, can solve the problems of large specific surface area, reduced makeup sustainability, unfavorable heat conduction of polymer matrix, etc., and achieve good compatibility

Pending Publication Date: 2022-04-22
ANHUI ESTONE MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the inorganic powder in this structure is covered and does not directly contact the polymer matrix, which is not conducive to the heat conduction of the polymer matrix.
[0004] The Chinese invention patent "A Method for Preparing PTFE Modified Inorganic Powder Composite Filler" with the application number 201910753994.7 discloses a PTFE powder-coated inorganic powder. The powder is coated with PTFE to form a heat-conducting barrier. Facilitates thermal conductivity of the polymer matrix
[0005] The Chinese invention patent with application number 201580077796.3 "Composite powder impregnated with inorganic powder in porous polymer, cosmetic composition containing the composite powder and its preparation method" discloses the use of a porous polymer containing inorganic powder, Addressed issues with reduced makeup sustainability
However, due to the porous structure of this kind of porous polymer, the specific surface area is large, and the viscosity of the system will increase when it is used in the resin.

Method used

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  • Composite particle for improving performance of copper-clad plate
  • Composite particle for improving performance of copper-clad plate
  • Composite particle for improving performance of copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] 8.56g of melamine and 20mL of 37% formaldehyde solution were dissolved in 50mL of water, and the reaction was increased to 95 °C for 1.5 hours, during which the pH of the system was maintained with 5% hydrochloric acid and sodium hydroxide solution of 9 to 10. After the reaction is reduced to room temperature to obtain a clear and transparent melamine-formaldehyde resin prepolymer solution. Take MF microspheres 10g, nano alumina 4g, deionized water 86g, put into a three-mouth flask, mechanically stirred for 30min, add 2g melamine - formaldehyde resin prepolymer solution, using 5% HCl to adjust the solution pH, keep the PH between 4 and 5, 85 °C water bath for 5h, filter drying, to obtain a powdered product.

Embodiment 2

[0045] 8.56g of melamine and 20mL of 37% formaldehyde solution were dissolved in 50mL of water, and the reaction was increased to 60 °C for 2.5 hours, during which the pH of the system was maintained with 5% hydrochloric acid and sodium hydroxide solution of 8~9. After the reaction is reduced to room temperature to obtain a clear and transparent melamine-formaldehyde resin prepolymer solution. Take MF microspheres 10g, nano alumina 6g, deionized water 86g, put into a three-mouth flask, mechanically stirred for 30min, add 1.5g melamine - formaldehyde resin prepolymer solution using 5% HCl adjustment solution PH, keep THE PH between 4 ~ 5, 85 °C water bath for 5h, filter drying, to obtain a powdered product.

Embodiment 3

[0047] 8.56g of melamine and 20mL of 37% formaldehyde solution were dissolved in 50mL of water, and the reaction was carried out at 90 °C for 1.5 hours, during which the pH of the system was maintained with 5% hydrochloric acid and sodium hydroxide solution of 8 to 9. After the reaction is reduced to room temperature to obtain a clear and transparent melamine-formaldehyde resin prepolymer solution. Take PS microspheres 10g, nano alumina 4g, deionized water 86g, put into a three-mouth flask, mechanically stirred for 30min, add 2g melamine - formaldehyde resin prepolymer solution using 5% HCl to adjust the solution PH, keep the PH between 4 ~ 5, 85 °C water bath for 5h, filter drying, to obtain a powdered product.

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Abstract

The invention belongs to the field of composite materials, and particularly relates to a composite particle for improving the performance of a copper-clad plate, the composite particle sequentially comprises a coating layer and a polymer particle from outside to inside, and the coating layer comprises inorganic powder and a binding substance. The method has the beneficial effects that 1, the inorganic powder is coated on the surfaces of the polymer microspheres, so that the addition amount of the inorganic powder in a resin system can be increased, and the influence of the inorganic powder on the viscosity of the system is reduced; and 2, the inorganic powder forms a coating through the bonding of the prepolymer, has organic components on the surface of the composite microsphere, and can have better compatibility with a resin matrix in a resin system.

Description

Technical field [0001] The present invention belongs to the field of composite materials, specifically relates to a composite particle that improves the performance of copper clad laminates. Background [0002] Copper clad laminate is a product made of glass fiber cloth as a reinforcing material, dipped in resin, covered with copper foil on one or both sides, and hot pressed. Copper clad laminate is the basic material of the electronics industry, mainly used in the processing and manufacture of printed circuit boards (PCBs), widely used in televisions, radios, computers, computers, mobile communications and other electronic products. In the copper clad plate, a large amount of nano-alumina needs to be added to increase the thermal conductivity and strength of the copper clad plate. However, due to the addition of nano-alumina, the viscosity of the resin system increases and the amount of addition is limited. Nano-alumina is not compatible with copper clad laminate resin and othe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/28C08L61/10C08K3/22C08K3/26
CPCC08L63/00C08L61/28C08L61/06C08K3/22C08K3/26C08K2201/011C08K2003/2227C08K2003/265
Inventor 郭敬新蒋学鑫王韶晖
Owner ANHUI ESTONE MATERIAL TECH CO LTD
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