Jig device for improving silver paste filling quality and silver paste filling method

A technology of filling quality and filling method, which is applied to electrical components, circuits, semiconductor devices, etc., and can solve problems such as insufficient filling of silver paste and poor filling quality

Pending Publication Date: 2022-04-15
SUZHOU TALESUN SOLAR TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the above-mentioned technical problems, the object of the present invention is to provide a jig device and a silver paste filling method for improving the filling quality of silver paste. Issues with poor fill quality

Method used

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  • Jig device for improving silver paste filling quality and silver paste filling method

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Embodiment Construction

[0039] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some, not all, embodiments of the present invention. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0040] The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0041] Such as figure 1 As shown, an embodiment of the present invention provides a jig device for improving the filling quality of silver paste, which is used to improve...

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Abstract

The invention relates to a jig device for improving silver paste filling quality and a silver paste filling method, and the jig device is used for improving the silver paste filling quality of a through hole in an MWT battery silicon wafer, and comprises a horizontally arranged carrier mechanism which comprises a U-shaped carrier which does not react with silver paste and a plurality of injection holes; the U-shaped carrier covers the inner wall of the carrier mechanism and is used for accommodating silver paste; the injection holes penetrate through the bottom of the U-shaped carrier, and the number of the injection holes is matched with the number of through holes in an MWT battery silicon wafer; the pushing mechanism is arranged above the carrier mechanism, and the width of the pushing mechanism is smaller than that of the opening of the U-shaped carrier; and the pushing mechanism comprises a pushing handle, a pushing plate and a partition plate which does not react with the silver paste and is used for downwards extruding the silver paste in the U-shaped carrier to enable the silver paste to be attached to the silicon wafer and fill the through hole, and the pushing handle, the pushing plate and the partition plate are sequentially connected from top to bottom. Through the above arrangement, the problems that at present, silver paste is not fully filled in a silicon wafer through hole of an MWT battery, and the filling quality is poor can be solved.

Description

technical field [0001] The invention relates to the field of photovoltaic technology, in particular to a jig device and a silver paste filling method for improving the filling quality of silver paste. Background technique [0002] In the MWT (Metal Wrap Through) battery, the front electrode is guided to the back of the battery by perforating the silicon wafer, which can not only reduce the shading area of ​​the front electrode, improve the conversion efficiency of the battery, but also improve the aesthetics of the photovoltaic module. . [0003] Therefore, MWT cells are suitable for use in the BIPV (Building Integrated Photovoltaic) industry, which has seen increasing demand in recent years. Among them, the filling quality of the silver paste in the through-hole of the silicon wafer has a significant impact on the cell efficiency and module power. [0004] In the prior art, the traditional screen printing process is very likely to cause insufficient silver paste filling i...

Claims

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Application Information

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IPC IPC(8): H01L31/18H01L31/0224
CPCH01L31/1804H01L31/02245
Inventor 张俊巍张树德钱洪强周海龙荆蓉蓉王展
Owner SUZHOU TALESUN SOLAR TECH CO LTD
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