Binding device and binding method for binding display module

A display module and binding technology, applied in the direction of electrical components, electrical components, etc., can solve the problems of thermal deterioration of components, reduce the production yield of display modules, affect the quality of display modules, etc., to increase the contact area , avoid heat deterioration, and ensure the effect of binding quality

Pending Publication Date: 2022-04-05
BAZHOU YUNGU ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the heat-compression binding process, part of the heat output by the heating components will cause thermal deterioration of the components in the non-heat-pressing area of ​​the display module, affect the quality of the display module, and reduce the production yield of the display module

Method used

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  • Binding device and binding method for binding display module
  • Binding device and binding method for binding display module
  • Binding device and binding method for binding display module

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Embodiment Construction

[0038] The characteristics and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only configured to explain the present invention, not to limit the present invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by showing examples of the present invention.

[0039] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation...

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Abstract

The embodiment of the invention provides a binding device and a binding method for binding a display module, the display module comprises a mounting component and a display panel, the binding device is used for hot-pressing and binding a first branch of the mounting component to a binding area of the display panel, and the binding device comprises: a bearing component; the heating component is arranged on one side of the bearing component, the heating component is movably arranged in the pressing direction, and the heating component is provided with a heating surface used for heating the first subsection; the one or more heat dissipation parts and the heating part are arranged on the same side of the bearing part, and the heat dissipation part is provided with a heat dissipation face used for making contact with a non-hot-pressing area of the display module so that the heat dissipation part can absorb heat of the non-hot-pressing area of the display module through the heat dissipation face. According to the binding device, the heat dissipation component is arranged to absorb heat of the non-hot-pressing area of the display module, the quality of the display module formed after hot-pressing binding is improved, and the preparation yield of the display module is increased.

Description

technical field [0001] The invention relates to the technical field of binding, in particular to a binding device and a binding method for binding display modules. Background technique [0002] Generally, the first subsection of the installation component is bonded to the display panel by thermal compression bonding to form a display module. During the heat-compression binding process, part of the heat output by the heating components will cause thermal deterioration of components in the non-heat-pressing area of ​​the display module, affect the quality of the display module, and reduce the manufacturing yield of the display module. [0003] Therefore, there is an urgent need for a new binding device and binding method. Contents of the invention [0004] Embodiments of the present application provide, on the one hand, a binding device for binding a display module, the display module includes a mounting part and a display panel, and the binding device is used for thermocom...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04
Inventor 赵茂章
Owner BAZHOU YUNGU ELECTRONICS TECH CO LTD
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