Server chassis

A server and chassis technology, used in instruments, electrical digital data processing, digital data processing components, etc., to solve problems such as power supply and motherboard temperature rise, downtime, and the chassis not working properly.

Inactive Publication Date: 2015-12-23
INSPUR BEIJING ELECTRONICS INFORMATION IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The wind blows in from the hard disk, and then passes through the main board and power supply. The wind that reaches the main board and power supply is already hot air, and the temperature will be very high. When the hot air passes through the main board and power supply, the temperature of the power supply and main board will rise. machine, the chassis does not work properly

Method used

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  • Server chassis

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Embodiment Construction

[0026] The core of the present invention is to provide a server chassis to improve the heat dissipation effect of the hard disk, the motherboard and the power supply, and avoid downtime.

[0027] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0028] Please refer to figure 1 , figure 1 It is a structural schematic diagram of a server chassis provided by the present invention, figure 1 The squa...

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Abstract

The invention discloses a server chassis. The server chassis comprises a hard disk, a power supply, a mainboard, a central processing unit (CPU), and a first baffle positioned behind the hard disk, wherein an air inlet of a cooling channel of the hard disk is formed in the front side wall of the server chassis. The server chassis further comprises a first fan and a second fan arranged on the left side wall and the right side wall of the server chassis respectively, and a second baffle positioned between the power supply and the mainboard, wherein an air inlet of a cooling channel of the mainboard is formed in the upper part of the rear side wall of the server chassis; and an air inlet of a cooling channel of the power supply is formed in the lower pat of the rear side wall of the server chassis. The server chassis further comprises a third fan and a fourth fan arranged at the upper part of the rear side wall of the server chassis, and a fifth fan and a sixth fan arranged at the lower part of the rear side wall of the server chassis. According to the server chassis disclosed by the invention, the heat dissipation effects of the hard disk, the mainboard and the power supply are improved, so that the downtime phenomenon can be avoided.

Description

technical field [0001] The technical field of servers involved in the present invention, in particular, relates to a server chassis. Background technique [0002] At present, almost all server and storage manufacturers generally adopt the traditional heat dissipation method. The wind enters from the hard disk in the front and exits from the rear through the motherboard system. But for high-density design, the hard disk is in the front, and the motherboard and power supply are in the back. In the case of high density, due to the large number of disks, the highest design in the industry has reached more than 90 pieces. The heat dissipation of the hard disk brings huge pressure. The temperature of the wind from the hard disk to the air inlet may reach more than 50 degrees. [0003] Hard disk, motherboard, and power supply are three parts. These three parts are the places with the most intensive heat dissipation requirements. In high-density cases, hard disk heat dissipation is...

Claims

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Application Information

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IPC IPC(8): G06F1/18G06F1/20
Inventor 孙磊李博乐
Owner INSPUR BEIJING ELECTRONICS INFORMATION IND
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