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Wafer-level LED packaging structure capable of dissipating heat

A LED packaging and wafer-level technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of low heat dissipation efficiency and low stability of wafer-level LED packaging structure, and achieve faster heat dissipation, improved ventilation performance, and improved The effect of mounting stability

Active Publication Date: 2022-04-01
江西瑞晟光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides a heat-dissipating wafer-level LED package structure, which effectively solves the problems of low stability of the wafer-level LED package structure and low heat dissipation efficiency in the above-mentioned background technology

Method used

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  • Wafer-level LED packaging structure capable of dissipating heat
  • Wafer-level LED packaging structure capable of dissipating heat
  • Wafer-level LED packaging structure capable of dissipating heat

Examples

Experimental program
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Effect test

Embodiment 1

[0036] Embodiment one, by Figure 1 to Figure 9 Given, the present invention comprises silicon base 1, and the interior of silicon base 1 is provided with accommodating groove one 2 and accommodating groove two 3, and accommodating groove one 2 is positioned at the top of accommodating groove two 3, and the top of silicon base 1 is provided with installation Groove 4, the inside of the installation groove 4 is equipped with a mounting base 5, the inside of the mounting base 5 is provided with an LED chip 6, the top of the mounting base 5 is equipped with a convex lens plate 7, and the outer wall of the LED chip 6 is provided with a fluorescent lamp located inside the mounting base 5. Powder layer 8, the top of silicon base 1 is provided with the lens protective cover 9 that is sleeved on the outer wall of mounting seat 5, is connected by screw rod 26 between lens protective cover 9 and silicon base 1, and the inside of accommodating groove-2 is provided with The installation mec...

Embodiment 2

[0040] Embodiment two, on the basis of embodiment one, by figure 1 It is given that the cooling rod 13 has a wave-shaped structure, and the cooling rod 13 is equidistantly provided with cooling holes 50, and the design of the cooling rod 13 and the cooling hole 50 in a wave-shaped structure effectively increases the contact between the cooling rod 13 and the air. area, thereby speeding up the heat dissipation efficiency of the heat dissipation rod 13, and further speeding up the heat dissipation speed of the LED chip 6.

Embodiment 3

[0041] Embodiment three, on the basis of embodiment one, by figure 1 , Figure 4 with Figure 5 Given, the pressing group includes a fixed cylinder 27, an annular groove 28, an annular rod 29, a pressing rod 30, a movable groove 31 and a spring, and the top of the silicon base 1 is provided with a fixed cylinder 27 sleeved on the outside of the lens protective cover 9. The inside of the barrel 27 is provided with an annular groove 28, and the interior of the annular groove 28 is provided with an annular rod 29. The annular rod 29 and the annular groove 28 are connected by equidistant springs. Through the active groove 31, the inner wall of the fixed cylinder 27 is symmetrically provided with a pressing rod 30, and one end of the pressing rod 30 runs through the movable groove 31 and is connected with the side wall of the annular rod 29, and the pressing rod 30 is located at the top of the screw rod 26;

[0042] The staff pulls the pressing rod 30 upwards, so that the pressin...

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Abstract

The invention relates to the technical field of LED packaging, and discloses a wafer-level LED packaging structure capable of dissipating heat, which solves the problems of low stability and low heat dissipation efficiency of the wafer-level LED packaging structure, and comprises a silicon base, a first accommodating groove and a second accommodating groove are formed in the silicon base, the first accommodating groove is positioned above the second accommodating groove, and the second accommodating groove is positioned above the second accommodating groove. An installation groove is formed in the top end of the silicon base, an installation base is installed in the installation groove, an LED chip is arranged in the installation base, a convex lens plate is installed at the top end of the installation base, a fluorescent powder layer located in the installation base is arranged on the outer wall of the LED chip, and a lens protection cover arranged on the outer wall of the installation base in a sleeving mode is arranged at the top end of the silicon base. The lens protection cover is connected with the silicon base through a screw rod, and a mounting mechanism connected with the mounting seat is arranged in the accommodating groove I; and through the design of the heat dissipation mechanism, blowing to the heat dissipation rod is realized, so that the heat dissipation speed of the heat dissipation rod is accelerated, and the protection of the LED chip is effectively realized.

Description

technical field [0001] The invention belongs to the technical field of LED packaging, in particular to a heat dissipation wafer-level LED packaging structure. Background technique [0002] As the fourth-generation green lighting source, LED has been widely used at present. Among them, the full-color LED device light source with adjustable dimming can be used in special occasions such as illusion and dimming, such as outdoor landscape lighting, shopping malls, In places such as counters, advertising walls, and coffee shops, the main factor affecting the life and luminous efficiency of LED products is not only the chip itself, but also the design of the packaging structure. [0003] The stability of the existing LED package structure is not high, and the LED chip will generate heat during operation. Due to the low heat dissipation efficiency of the LED package structure, the service life of the LED chip will be affected. Contents of the invention [0004] In view of the abo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62H01L33/64
Inventor 李仁刘山蔡杰君吴强
Owner 江西瑞晟光电科技有限公司
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