Preparation method of epoxy board with glass fabric sandwiched

A technology of sandwiching glass fiber cloth and epoxy board, which is applied in the direction of electrical components, insulators, circuits, etc., can solve the problems of poor bonding force and low surface activity of epoxy board, so as to improve the flexural modulus of elasticity and enhance the core competitiveness of enterprises Good strength and product toughness

Pending Publication Date: 2022-04-01
PAMICA TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the surface of the epoxy board is attached to the release film during the production process, the transfer and residue of the release agent will result in low surface activity of the epoxy board and poor bonding with other materials

Method used

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  • Preparation method of epoxy board with glass fabric sandwiched
  • Preparation method of epoxy board with glass fabric sandwiched

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] The preparation method of glass fiber cloth epoxy board comprises the following steps:

[0025] S1 Monohydroxyorganosiloxane M and trihydroxyorganosiloxane are hydrolyzed in a water bath (temperature 40±10°C) under the action of n-butanol as a catalyst; heat up to 110±20°C and reflux for 1 to 3 hours, then heat up to Evaporate by-products at 140 ± 20°C; add toluene to neutralize to neutral, add solvent toluene, adjust the solid content to 50 ± 10%, and make silicone water.

[0026] S2 uses the sizing process to make the organic silicon solvent penetrate into the mica paper and glass fiber cloth evenly; among them, the mica paper is made by the swirl papermaking process to ensure that the uniformity of the mica paper is ±2g / m 2 Within, make the mica paper that is suitable for the product use.

[0027] S12 Bake the volatiles in the volatile solvent through the drying tunnel to ensure that the mica paper and glass fiber cloth are dry and the solvent penetrates evenly afte...

Embodiment 2

[0035] Example 2 Compared with Example 1, adjust S12 to bake the volatile matter in the volatile solvent through the drying tunnel to ensure that the mica paper and glass fiber cloth are dry and the solvent penetrates evenly after gluing; the temperature in the front section of the drying tunnel is 20°C-60°C, The baking time is 0.5-2min, to preliminarily volatilize the volatiles in the solvent; the temperature in the middle section of the drying tunnel is 60°C-120°C, and the baking time is 0.5-2min, to further volatilize the volatiles in the solvent, and the temperature at the end of the drying tunnel The temperature is 100°C-140°C, the baking time is 0.5-2min, and the remaining volatilization in the solvent is volatilized.

Embodiment 3

[0036] Example 3 Compared with Example 1, adjust the S23 pressing process, after a long time of high temperature and high pressure, the solvent in the semi-finished blank is completely volatilized, and the remaining raw glue is completely cured with mica paper and glass fiber cloth to ensure that the finished product is good. strength. The pressing process is as follows: the first stage of pressing, the initial temperature is 100±15°C, the ending temperature is 100°C, the pressure is 1.5-12Mpa, the holding time is 10min, and the number of exhaust is 1 time.

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Abstract

The invention discloses a preparation method of a glass fabric-sandwiched epoxy board. The preparation method comprises the following steps: S1, carrying out sizing permeation on mica paper and glass fabric by using organic silica gel water; and S2, carrying out paper receiving, weight balancing, glass fabric clamping and plate stacking, plate tearing, pressing and plate shearing, so as to prepare the glass fabric clamping epoxy plate. The bending elastic modulus of the produced glass fiber cloth product is improved in the aspect of performance, and the glass fiber cloth product is not prone to breakage and good in toughness.

Description

technical field [0001] The invention relates to the field of electrical insulating materials, in particular to a method for preparing an epoxy board sandwiched with glass fiber cloth. Background technique [0002] Epoxy boards have good mechanical properties and excellent electrical properties at high humidity. Widely used in mechanical, electrical and electronic industries. Since the surface of the epoxy board is attached to the release film during the production process, the transfer and residue of the release agent will result in low surface activity of the epoxy board and poor bonding with other materials. Further improving the performance, flexural modulus and toughness of the epoxy board has broad application prospects. Contents of the invention [0003] In order to achieve the above object, the present invention provides the following technical solutions: a method for preparing an epoxy board with glass fiber cloth, which is characterized in that it comprises the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B19/00
Inventor 黎清泉方爱国
Owner PAMICA TECH CORP
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