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LED chip and manufacturing method thereof

A technology of LED chips and manufacturing methods, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., and can solve problems such as burn damage of LED chips

Pending Publication Date: 2022-03-25
XIAMEN CHANGELIGHT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the sidewall of the LED chip will expose the N-type layer of the LED chip, and in actual work, the LED chip will be in a reverse bias state for a long time due to work requirements, resulting in the N-type layer being exposed to the reverse bias electric field. Under the environment, an electrochemical reaction occurs with the water vapor in the environment, which will cause burn damage to the LED chip

Method used

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  • LED chip and manufacturing method thereof
  • LED chip and manufacturing method thereof
  • LED chip and manufacturing method thereof

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Embodiment Construction

[0047] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0048] In the following description, a lot of specific details are set forth in order to fully understand the application, but the application can also be implemented in other ways different from those described here, and those skilled in the art can do without violating the connotation of the application. By analogy, the present application is therefore not limited by the specific embodiments disclosed below.

[0049] Secondly, the present application is described in detail in comb...

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Abstract

The embodiment of the invention discloses an LED chip and a manufacturing method thereof, the LED chip comprises a chip substrate, an epitaxial structure, a P-type electrode, an N-type electrode and an insulating layer, the epitaxial structure comprises a first P-type layer, a first active layer and a first N-type layer, the first N-type layer comprises a first N-type sub-layer and a second N-type sub-layer, the active layer and the first N-type sub-layer expose part of the surface of the P-type layer, and the first N-type sub-layer and the second N-type sub-layer expose part of the surface of the P-type layer. The second N-type sub-layer is located on the surface of the first N-type sub-layer, the N-type electrode is located on the side, away from the surface of the chip substrate, of the second N-type sub-layer and covers the second N-type sub-layer, and the insulating layer covers the part, except the surface of the P-type electrode and the surface of the N-type electrode, of the surface of the LED chip. Therefore, the N-type electrode covers the second sub-N-type layer, the second sub-N-type layer can be prevented from being exposed, and the insulating layer wraps the uncovered parts of the first sub-N-type layer and the second sub-N-type layer, so that electrochemical reaction between the N-type layer and water vapor in the environment can be inhibited.

Description

technical field [0001] The present application relates to the technical field of LED manufacturing, in particular to an LED chip and a method for manufacturing the LED chip. Background technique [0002] With the maturity of blue-green LED chip technology, LED display products composed of RGB three-color LED chips have the advantages of realizing high-resolution small-pitch or even ultra-fine-pitch display, and also have high color uniformity, The advantages of high color expression and environmental protection make the LED display products composed of LED chips very competitive in the market, and the application market continues to expand. [0003] While the LED display application market continues to expand, in order to ensure the reliability of LED display products, LED display packaging manufacturers have put forward higher requirements for the reliability of LED chips. However, since the sidewall of the LED chip will expose the N-type layer of the LED chip, and in actu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/44H01L33/38H01L33/00
CPCH01L33/44H01L33/38H01L33/005
Inventor 周弘毅曹衍灿李健林锋杰王锐崔恒平蔡玉梅蔡海防
Owner XIAMEN CHANGELIGHT CO LTD
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