Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Polishing device, polishing equipment and polishing method

A technology for grinding surfaces and grinding heads, which is applied to grinding drive devices, grinding/polishing equipment, metal processing equipment, etc. Improve grinding efficiency and grinding yield, improve the effect of surface quality

Pending Publication Date: 2022-03-25
DONGGUAN CHANGYING PRECISION TECH CO LTD
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] When the manipulator drives the grinding tool to grind the workpiece, the contact surface between the grinding tool and the workpiece needs to be level to ensure that the grinding degree of each part of the workpiece is consistent. When the workpiece is polished in the state of unqualified levelness, it is easy to cause adverse phenomena such as sagging and overgrinding of the workpiece, which will affect the grinding yield of the workpiece

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polishing device, polishing equipment and polishing method
  • Polishing device, polishing equipment and polishing method
  • Polishing device, polishing equipment and polishing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0031] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a grinding device, grinding equipment and a grinding method. The grinding device comprises a grinding jig, a grinding tool and a pressure sensor, and the grinding jig is used for clamping a workpiece to be ground; the polishing tool is used for being connected with the mechanical arm, the mechanical arm can drive the polishing tool to move and rotate, and the polishing tool is used for polishing a workpiece and provided with a probe point; the pressure sensor is arranged on the polishing jig and electrically connected with the manipulator, and the pressure sensor is used for detecting a pressure value of a probe point of the polishing tool when the pressure sensor is in contact with the probe point of the polishing tool and feeding back a detection result of the pressure value of the probe point to the manipulator; the manipulator can calculate the levelness and the levelness compensation value of the polishing tool based on a preset algorithm of the manipulator and according to the detection result of the pressure numerical value of the probe point fed back by the pressure sensor, and the manipulator can further drive the polishing tool to rotate according to the levelness compensation value so as to correct the levelness of the polishing tool.

Description

technical field [0001] The invention relates to the technical field of product processing, in particular to a grinding device, grinding equipment and a grinding method. Background technique [0002] When the manipulator drives the grinding tool to grind the workpiece, the contact surface between the grinding tool and the workpiece needs to be level to ensure that the grinding degree of each part of the workpiece is consistent. When the workpiece is polished in the state of unqualified levelness, it is easy to cause adverse phenomena such as sagging and overgrinding of the workpiece, thereby affecting the grinding yield of the workpiece. Contents of the invention [0003] Based on this, the present invention provides a grinding device, grinding equipment and grinding method capable of improving the grinding efficiency and grinding yield of workpieces. [0004] A polishing device, comprising: [0005] Grinding jig, used to clamp the workpiece to be polished; [0006] A gr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B24B19/00B24B41/04B24B41/06B24B47/22B24B49/00
CPCB24B19/00B24B41/06B24B41/04B24B47/22B24B49/00
Inventor 肖堂升吴文斌
Owner DONGGUAN CHANGYING PRECISION TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com