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Silicon dioxide micropowder filler composition for high-thermal-conductivity and high-fluidity EMC (Electro Magnetic Compatibility) and preparation method thereof

A technology of silica and high fluidity, applied in chemical instruments and methods, heat exchange materials, etc., can solve the problems of high storage modulus, low filler content, low bending strength, etc., achieve high packaging integration, improve Filling, close-packed effect

Pending Publication Date: 2022-03-11
联瑞新材(连云港)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004]However, high thermal conductivity fillers such as aluminum oxide, aluminum nitride, and magnesium oxide have low filler content, high cost, poor fluidity, and Issues such as low flexural strength and high storage modulus, especially production cost, fluidity, and flexural strength are the main obstacles restricting the application of such high thermal conductivity fillers

Method used

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  • Silicon dioxide micropowder filler composition for high-thermal-conductivity and high-fluidity EMC (Electro Magnetic Compatibility) and preparation method thereof
  • Silicon dioxide micropowder filler composition for high-thermal-conductivity and high-fluidity EMC (Electro Magnetic Compatibility) and preparation method thereof
  • Silicon dioxide micropowder filler composition for high-thermal-conductivity and high-fluidity EMC (Electro Magnetic Compatibility) and preparation method thereof

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Experimental program
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Effect test

preparation example Construction

[0037] The preparation method of silicon dioxide micropowder composition, concrete steps are as follows:

[0038] According to the parts by weight of Table 1, the rounded silica micropowder, spherical silica micropowder, angular silica micropowder, ultrafine silica micropowder and fused silica micropowder are put into a high-speed mixer for mixing, and The time is 15min, the mixing temperature is 90°C, after mixing, add the surface treatment agent γ-aminopropyltriethoxysilane (KH550), the modification temperature is 120°C, the modification time is 10min, after the modification is completed, cool to room temperature , and sieved to obtain a silicon dioxide micropowder composition with a certain particle size distribution.

[0039] The composition of silicon dioxide micropowder composition in each embodiment of table 1 and comparative example

[0040]

[0041] The fluidity of the silicon dioxide micropowder composition in each embodiment and comparative example is according ...

Embodiment 1

[0051] Comparing Example 1 and Example 3 with Comparative Examples 12 and 13, it is found that the more spherical silica powder is added, the better the fluidity performance and the worse the thermal conductivity, but the increase in spherical silica powder will lead to higher costs.

Embodiment 5

[0052] Comparing Example 5, Example 6, and Example 7 with Comparative Examples 14 and 15, it is found that the amount of angular silica micropowder is reduced, the thermal conductivity is worse, and the fluidity is better. Controlling the amount of addition is mainly to control costs.

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Abstract

The invention discloses a silicon dioxide micro-powder filler composition for high thermal conductivity and high fluidity EMC (Electro Magnetic Compatibility) and a preparation method of the silicon dioxide micro-powder filler composition. The filler composition is formed by adopting fillet, spherical, angular, superfine and fused silica micro powder with different morphologies as raw materials according to a ratio, and is matched with the surface treating agent to obtain the filler with multiple peaks, high stacking density, good fluidity and high heat conductivity coefficient, and the filler has excellent comprehensive performance and is suitable for industrial production. And the method is suitable for large-scale high-end products such as energy modules with high packaging integration and complex structures.

Description

technical field [0001] The invention belongs to the technical field of deep processing of inorganic non-metallic materials, and relates to a silica micropowder filler composition for EMC with high thermal conductivity and high fluidity and a preparation method thereof. Background technique [0002] With the rapid development of electronic information technology, higher and higher requirements are put forward for the miniaturization and portability of electronic products. The rapid increase of chip integration will inevitably lead to an increase in heat generation, and the operating temperature of the circuit will continue to rise. If the heat dissipation is not good, it will easily lead to chip failure. At present, the method to improve the thermal conductivity of EMC is mainly to select and modify inorganic fillers. This is mainly because the thermal conductivity of epoxy resins and curing agents commonly used in EMC is usually only 0.05-0.5W / m·K. And some inorganic fille...

Claims

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Application Information

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IPC IPC(8): C08K9/06C08K3/36C08K7/18C08K7/00C08L63/00C09K5/14
CPCC08K9/06C08K3/36C08K7/18C08K7/00C09K5/14C08K2201/005C08L63/00
Inventor 林铭曹家凯周晓兵徐华强王二里
Owner 联瑞新材(连云港)有限公司
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