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Low-resilience and anti-powder-falling silica gel heat-conducting gasket and preparation method thereof

A heat-conducting gasket and low-rebound technology, applied in the field of thermal interface materials, can solve problems such as difficult to control the compression degree of silicone heat-conducting gaskets, affect the heat dissipation performance of electronic products, and unsatisfactory heat conduction effects, and achieve particle size reduction and compressibility The effect of reducing the property and resilience and facilitating the demolding

Active Publication Date: 2022-02-01
SHENZHEN HFC SHIELDING PRODS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] There are differences in the performance of different silicone thermal pads. At present, the silicone thermal pads on the market have relatively large compressibility and resilience properties, resulting in a large elastic space between electronic components and heat sinks during assembly.
Due to the influence of the compression and rebound performance of the silicone thermal pad, it is difficult to control the compression degree of the silicone thermal pad during assembly, which will cause springback deformation between the electronic components and the thermal pad, and between the thermal pad and the heat sink. A certain gap cannot fit well. The air in the gap has a large thermal resistance, which will cause unsatisfactory heat conduction effect and affect the heat dissipation performance of electronic products.

Method used

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  • Low-resilience and anti-powder-falling silica gel heat-conducting gasket and preparation method thereof
  • Low-resilience and anti-powder-falling silica gel heat-conducting gasket and preparation method thereof
  • Low-resilience and anti-powder-falling silica gel heat-conducting gasket and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-3

[0047] Provide a low-rebound, powder-free silicone thermal pad, which is prepared according to the dosage in Table 2 using the following scheme:

[0048] Add vinyl silicone oil and thermal conductive filler into the kneader and stir for 45 minutes, then add alkynyl cyclohexanol, hydrogen-containing silicone oil, platinum catalyst, internal mold release agent and silicone powder in turn and stir for 60 minutes; put the mixture into the calender, and Calendered in a vacuum environment of -0.1MPa, and then baked in an oven at 120°C for 30 minutes to obtain a fully cured large piece of low-rebound, non-powder-dropping silicone thermal pad, and finally the large piece of low-rebound, non-powder-dropping The silicone thermal pad is cut to the specified size.

[0049] Among them, the viscosity of the vinyl silicone oil is 200 mPa·s, and the viscosity of the hydrogen-containing silicone oil is 500 mPa·s.

[0050] The thermally conductive filler is micron-sized alumina, and its partic...

Embodiment 4-7

[0055] Embodiments 4-7 provide a low-rebound, non-powder-dropping silica gel heat-conducting gasket, which is different from Embodiment 3 in that the particle size ratio of micron-sized alumina is different. See Table 3 for the proportions of micron-sized aluminas with different particle sizes in Examples 4-7.

[0056] Table 3: Proportioning ratios of micron-sized aluminas with different particle sizes in Examples 4-7

[0057]

Embodiment 8-12

[0059] Embodiments 8-12 provide a low-rebound, non-powder-dropping silica gel thermal pad. The difference from Embodiment 7 is that the thermally conductive filler used is a combination of micron-sized alumina and micron-sized aluminum nitride, and in some embodiments Add nano-scale aluminum nitride with a particle size of 50-100nm. The proportions of micron-sized aluminum oxide, micron-sized aluminum nitride and nano-sized aluminum nitride in Examples 8-12 are shown in Table 4 below.

[0060] Table 4: Proportions of each component thermally conductive filler in Examples 8-12 (unit: g)

[0061] Example 8 Example 9 Example 10 Example 11 Example 12 Micron alumina 450 690 680 680 680 Micron Aluminum Nitride 440 200 210 210 210 Nanoscale Aluminum Nitride 0 0 10 80 45

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Abstract

The invention relates to the field of thermal interface materials, and particularly discloses a low-resilience and anti-powder-falling silica gel heat-conducting gasket and a preparation method thereof. The silica gel heat-conducting gasket is prepared from the following raw materials: vinyl silicone oil, heat-conducting filler, hydrogen-containing silicone oil, an inhibitor, a catalyst, an internal release agent and a modified additive. The preparation method comprises the following steps: carrying out primary kneading on the vinyl silicone oil and the heat-conducting filler; then sequentially adding an inhibitor, hydrogen-containing silicone oil, a catalyst, an internal release agent and a modified additive, and carrying out secondary kneading; then calendaring and molding in a vacuum environment; then drying to obtain the large low-resilience and anti-powder-falling silica gel heat-conducting gasket; and finally, cutting into a specified size. The prepared silica gel heat-conducting gasket is low in rebound rate and free of powder falling, and can be effectively applied to the field of heat conduction of electronic products.

Description

technical field [0001] The present application relates to the field of thermal interface materials, more specifically, it relates to a low-rebound, powder-free silica gel heat-conducting gasket and a preparation method thereof. Background technique [0002] With the development of integration technology and microelectronic assembly in the direction of densification, the heat generated during the use of electronic equipment is also increasing rapidly. If the heat generated during the use of electronic equipment is not conducted in time, it will greatly affect the performance of electronic devices, and in severe cases, the life of electronic devices will be reduced or even fail. In order to solve this problem, a layer of thermal interface material is usually placed on the heat exchange surface of electronic components with large heat generation, and the heat generated by electronic components is quickly conducted through the thermal interface material to protect the working pe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B26/32C04B111/28C04B111/50
CPCC04B26/32C04B2201/32C04B2201/50C04B2111/28C04B2111/503C04B14/303C04B24/02C04B22/04Y02E60/10
Inventor 吴燚鹏孙爱祥羊尚强曹勇窦兰月周晓燕
Owner SHENZHEN HFC SHIELDING PRODS CO LTD
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