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Machining apparatus

一种加工装置、工作台的技术，应用在研磨装置、磨削驱动装置、金属加工设备等方向，能够解决卡盘工作台磨削加工不恒定等问题，达到抑制厚度偏差的效果

Pending Publication Date: 2022-01-21
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Therefore, it is an object of the present invention to provide a processing device capable of solving the problem of suctioning and holding a wafer on the chuck when grinding the holding surface of the chuck table in the form of the frame constituting the chuck table. The problem of inconsistency in the case of grinding the wafer without the holding surface of the stage

Method used

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Embodiment Construction

[0021] Hereinafter, a processing apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings.

[0022] figure 1 An overall perspective view of a grinding device 1 as a processing device according to the present embodiment is shown. figure 1 The shown grinding device 1 has: a chuck table mechanism 3 as a holding unit for sucking and holding a plate-shaped semiconductor wafer (hereinafter simply referred to as a wafer) 10 as a workpiece of this embodiment; The grinding unit 4 grinds the wafer 10 held by the chuck table mechanism 3 ; and the processing liquid supply unit 5 supplies the processing liquid to the wafer 10 .

[0023] The grinding device 1 has a device housing 2 . The device case 2 has a substantially rectangular parallelepiped main body 21 and an upstanding wall 22 provided at the rear end of the main body 21 and vertically erected.

[0024] The chuck table mechanism 3 is disposed on the main body portio...

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PUM

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Abstract

The present invention provides a machining apparatus that can solve the case of grinding the holding surface of a chuck table and the case of sucking and holding a wafer on the holding surface of the chuck table to perform the grinding process. non-constant problem. The machining apparatus includes a chuck table mechanism including a chuck table configured to hold the wafer and a table base configured to support the chuck table in a detachable manner. The chuck table includes a porous plate having a suction surface that sucks the wafer, a frame body surrounding surfaces of the porous plate other than the suction surface of the porous plate, a wafer suction hole formed in the frame body and configured to transmit a suction force to the suction surface of the porous plate, and a bolt hole formed in the frame body and configured to fix the frame body to the table base.

Description

technical field [0001] The present invention relates to a processing device comprising: a holding unit that suction-holds a wafer; a processing unit that has a rotatable grinding wheel that grinds the wafer held by the holding unit; and processing The liquid supply unit supplies the processing liquid to the wafer. Background technique [0002] The wafer divided by a plurality of intersecting dividing lines and formed with multiple devices such as IC and LSI on the front side is ground and processed to a desired thickness on the back side, and then divided into individual device chips by a dicing device and a laser processing device. The device chips obtained by dividing are used in electronic equipment such as mobile phones and personal computers. [0003] The grinding device has: a holding unit that attracts and holds the wafer; a processing unit that has a rotatable grinding wheel that grinds the wafer held by the holding unit; and a processing fluid supply unit that The...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B19/22B24B41/02B24B41/04B24B41/06B24B47/12B24B57/02
CPCB24B19/22B24B41/02B24B41/06B24B47/12B24B41/04B24B57/02H01L21/6836H01L21/6838B24B37/04H01L2221/68327B24B41/061B24B37/30B32B38/10Y10T156/1944B32B43/006Y10T156/1132
Inventor 浅井宏平
Owner DISCO CORP
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