A conductive adhesive test module
A technology for testing modules and conductive adhesives, which is applied in the preparation of test samples, measuring devices, sampling, etc., which can solve the problem of reducing the test accuracy of the bonding ability of conductive adhesives, the contact between conductive adhesives and the surface of material plates, and affecting the bonding of conductive adhesives Capability testing and other issues to achieve the effect of ensuring accuracy, avoiding inconsistency in size, and consistent contact area
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[0028] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways defined and covered by the claims.
[0029] refer to Figure 1-Figure 4 , a conductive adhesive test module, including a placement board 1, a placement device 2, a glue filling device 3 and a pressure device 4, the upper end of the placement board 1 is sequentially installed with a placement device 2 and a pressure application device from left to right In the device 4, the glue filling device 3 is installed in the middle of the placement device 2, and the pressure applying device 4 is fixedly connected with the placement device 2.
[0030] refer to Figure 5 , Figure 6 and Figure 8 , the placement device 2 includes a mounting plate 21, a rectangular block 22, a placement ring frame 23, a limiting plate 24, a limiting spring 25, a cylindrical rod 26, a gathering ring plate 27, a cu...
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