Intelligent silicon-based wafer ultra-precision grinding and polishing machine based on self-learning

Abstract

The invention relates to the technical field of wafer processing, in particular to an intelligent silicon-based wafer ultra-precision grinding and polishing machine based on self-study, including a stand, the top of the stand is provided with a lower grinding disc, and the middle of the lower grinding disc and the stand is pierced There is a main shaft, and an upper grinding disc is arranged above the lower grinding disc, and an eccentric transmission cylinder is provided outside the main shaft, and the eccentric transmission cylinder is connected with the main shaft through an eccentric movement mechanism, and the main shaft is connected with a planetary motion workpiece disc through the eccentric transmission cylinder; The top of the grinding table is connected with a pressure plate, and the outer wall and inner wall of the pressure plate are respectively movably matched with the top outer wall of the stand and the outer wall of the eccentric transmission cylinder. The invention can drive the planetary motion workpiece plate to move through the eccentric transmission cylinder, so that the wafer During the process, it can not only rotate on itself, but also revolve around the main shaft, and can also move back and forth eccentrically in a straight line, so that the wafer can be subjected to grinding effects in various directions, and the abrasive particles can exert more directions on the wafer, greatly improving the grinding efficiency. .

Description

technical field [0001] The invention relates to the technical field of wafer processing, in particular to an intelligent silicon-based wafer ultra-precision grinding and polishing machine based on self-learning. Background technique [0002] Wafer refers to the silicon wafer used in the manufacture of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; it can be processed into various circuit element structures on the silicon wafer, and become an IC with specific electrical functions. product. The original material of the wafer is silicon, and the surface of the earth's crust has an inexhaustible amount of silicon dioxide. The silica ore is refined by an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polysilicon with a purity of up to 99.999999999%; the purpose of wafer grinding is to remove saw marks and If the wafer is damaged, make the surface of the wafer reach the required smoot...

AI Technical Summary

Problems solved by technology

Silica ore is refined by electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polysilicon, with a purity of up to 99.999999999%. The purpose of wafer grinding is to remove saw marks and damage, so that the surface of the wafer reaches the required smoothness, and the edge and surface of the wafer are polished to further remove the tiny particles attached to the wafer; At present, my country's high-end ultra-precision silicon-based wafer grinding and polishing machines are completely dependent on imports. In the absence of relaxation of Sino-US relations in the near future, imported technology may be stuck at any time, which will seriously affect my country's high-end equipment. chip development

[0006] (3) A large number of fine particles will be produced during grinding. If they are not removed in time, the grinding effect will be uneven. The existing grinding liquid flows out from the middle of the upper grinding table. The fine particles produced cannot be washed away quickly

[0007] (4) During the grinding process, the grinding table and the gear plate on which the workpiece is placed are constantly being rubbed, which will cause the temperature to rise, which in turn will lead to a decrease in the grinding accuracy. The existing equipment is directly washed by the grinding liquid, and the constant temperature control effect is poor.

[0008] (5) Before grinding, the wafer needs to be removed from the wafer basket and placed in the workpiece hole. After grinding, the wafer needs to be taken out from the workpiece hole and placed in the wafer basket. The wafers need to be taken out one by one, which is troublesome. and inefficient

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