A circuit board and manufacturing process of a transparent LED display
A technology of LED display screen and manufacturing process, which is applied in the direction of printed circuit, printed circuit, circuit heating device, etc., can solve the problems of ineffective heat dissipation, waterproof, short circuit, circuit board damage, etc., and achieves improved processing performance and is not easy Excellent effect on damage, heat dissipation and waterproof
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0041] A circuit board 1 of a transparent LED display, such as Figure 1~2 As shown, it includes a PCB board 2 and an LED lamp bead 3 arranged on one side of the PCB board 2; the PCB board 2 includes a substrate 4, wherein both sides of the substrate 4 are sequentially provided with a prepreg 5 and an etched copper clad laminate 6, The material of the substrate 4 is polyimide, the thickness of the prepreg 5 is 0.1 mm, the thickness of the substrate 4 is 0.3 mm, and the thickness of the etched copper clad laminate 6 is 0.2 mm; the surface of the PCB board 2 is coated with an insulating heat dissipation layer 7.
[0042] The LED lamp bead 3 includes one or more of white light bead, yellow light bead, blue light bead and red light bead.
[0043] The insulating and heat-dissipating layer 7 is prepared from modified polyimide, which is prepared by mixing polyimide resin and modifier in dimethylformamide, and then vacuum drying; wherein , the mass ratio of polyimide resin, modifie...
Embodiment 2
[0057] A circuit board 1 of a transparent LED display, such as Figure 1~2 As shown, it includes a PCB board 2 and an LED lamp bead 3 arranged on one side of the PCB board 2; the PCB board 2 includes a substrate 4, wherein both sides of the substrate 4 are sequentially provided with a prepreg 5 and an etched copper clad laminate 6, The material of the substrate 4 is polyimide, the thickness of the prepreg 5 is 0.1 mm, the thickness of the substrate 4 is 0.3 mm, and the thickness of the etched copper clad laminate 6 is 0.2 mm; the surface of the PCB board 2 is coated with an insulating heat dissipation layer 7.
[0058] The LED lamp bead 3 includes one or more of white light bead, yellow light bead, blue light bead and red light bead.
[0059] The insulating and heat-dissipating layer 7 is prepared from modified polyimide, which is prepared by mixing polyimide resin and modifier in dimethylformamide, and then vacuum drying; wherein , the mass ratio of polyimide resin, modifie...
Embodiment 3
[0073] A circuit board 1 of a transparent LED display, such as Figure 1~2 As shown, it includes a PCB board 2 and an LED lamp bead 3 arranged on one side of the PCB board 2; the PCB board 2 includes a substrate 4, wherein both sides of the substrate 4 are sequentially provided with a prepreg 5 and an etched copper clad laminate 6, The material of the substrate 4 is polyimide, the thickness of the prepreg 5 is 0.1 mm, the thickness of the substrate 4 is 0.3 mm, and the thickness of the etched copper clad laminate 6 is 0.2 mm; the surface of the PCB board 2 is coated with an insulating heat dissipation layer 7.
[0074] The LED lamp bead 3 includes one or more of white light bead, yellow light bead, blue light bead and red light bead.
[0075] The insulating and heat-dissipating layer 7 is prepared from modified polyimide, which is prepared by mixing polyimide resin and modifier in dimethylformamide, and then vacuum drying; wherein , the mass ratio of polyimide resin, modifie...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com